Inventor · disambiguated record
Toshimi Nakamura
Also filed as: NAKAMURA TOSHIMI
25 granted patents·9 pending applications·87 citations·filing 2001–2023
94Inventor score
Files withMITSUI MINING & SMELTING CO16MITSUI MINING & SMELTING CO LTD13MATSUURA YOSHINORI1NAKAMURA TOSHIMI1NISSAN DIESEL MOTOR CO1
Top patents by PatentIndex Score
34 records- 0182US11525073B2Multilayer circuit board manufacturing methodMITSUI MINING & SMELTING CO LTD·Filed 2017·Granted Dec 13, 2022·3 cites·12 claims
- 0281US7028533B2Flow rate measuring method and flowmeter, flow rate measuring section package used for them and flow rate measuring unit using them, and piping leakage inspection device using flowmeterMITSUI MINING & SMELTING CO·Filed 2005·Granted Apr 18, 2006·11 cites·9 claims
- 0380US8384197B2Semiconductor device and method for manufacturing sameTOSHIBA KK·Filed 2011·Granted Feb 26, 2013·5 cites·20 claims
- 0477US11527415B2Multilayer circuit board manufacturing methodMITSUI MINING & SMELTING CO LTD·Filed 2017·Granted Dec 13, 2022·2 cites·8 claims
- 0576US11756845B2Copper foil with glass carrier and production method thereforMITSUI MINING & SMELTING CO LTD·Filed 2019·Granted Sep 12, 2023·2 cites·16 claims
- 0676US7574897B2Device for detecting leakage of liquid in tankMITSUI MINING & SMELTING CO·Filed 2005·Granted Aug 18, 2009·8 cites·8 claims
- 0773US10840180B2Production method for multilayer wiring boardMITSUI MINING & SMELTING CO·Filed 2016·Granted Nov 17, 2020·2 cites·12 claims
- 0871US6920778B2Device for detecting leakage of liquid in tankMITSUI MINING & SMELTING CO·Filed 2002·Granted Jul 26, 2005·14 cites·53 claims
- 0967US7334455B2Leak detector of liquid in tankMITSUI MINING & SMELTING CO·Filed 2004·Granted Feb 26, 2008·13 cites·31 claims
- 1065US11071214B2Method for manufacturing multilayer wiring boardMITSUI MINING & SMELTING CO·Filed 2016·Granted Jul 20, 2021·1 cites·9 claims
- 1165US7618593B2Reducing agent container having novel structureNISSAN DIESEL MOTOR CO·Filed 2007·Granted Nov 17, 2009·3 cites·6 claims
- 1264US9029885B2Electrode foil and electronic deviceMITSUI MINING & SMELTING CO·Filed 2012·Granted May 12, 2015·2 cites·18 claims
- 1364US7536900B2Leak detector and leak detecting system using the sameMITSUI MINING & SMELTING CO·Filed 2004·Granted May 26, 2009·11 cites·15 claims
- 1463US12193153B2Multilayer bodyMITSUI MINING & SMELTING CO LTD·Filed 2021·Granted Jan 7, 2025·0 cites·7 claims
- 1559US6973827B2Flow rate measuring method and flowmeter, flow rate measuring section package used for them and flow rate measuring unit using them, and piping leakage inspection device using flowmeterMITSUI MINING & SMELTING CO·Filed 2003·Granted Dec 13, 2005·8 cites·12 claims
- 1654US9786404B2Metal foil and electronic deviceMITSUI MINING & SMELTING CO·Filed 2013·Granted Oct 10, 2017·0 cites·13 claims
- 1752US11317522B2Wiring board manufacturing methodMITSUI MINING & SMELTING CO LTD·Filed 2018·Granted Apr 26, 2022·0 cites·8 claims
- 1851US10283728B2Electrolytic copper foil and manufacturing method thereforMITSUI MINING & SMELTING CO·Filed 2014·Granted May 7, 2019·0 cites·6 claims
- 1950US2025227855A1Metal foil with carrierMITSUI MINING & SMELTING CO LTD·Filed 2023·Application pending·0 cites
- 2048US2010212400A1Detection unit mold package and fluid discrimination sensor module using the mold packageNAKAMURA TOSHIMI·Filed 2008·Application pending·0 cites
- 2148US2025065617A1Sheet fixing device, sheet peeling device, and sheet peeling methodMITSUI MINING & SMELTING CO LTD·Filed 2022·Application pending·0 cites
- 2247US2024297064A1Circuit board manufacturing methodMITSUI MINING & SMELTING CO LTD·Filed 2022·Application pending·0 cites
- 2346US9508951B2Electrode foil and organic light-emitting deviceMITSUI MINING & SMELTING CO·Filed 2013·Granted Nov 29, 2016·0 cites·11 claims
- 2446US2008184775A1Fluid Identification Device and Fluid Identification MethodMITSUI MINING & SMELTING CO·Filed 2007·Application pending·0 cites
- 2545US11935865B2Semiconductor package manufacturing method, and adhesive sheet used thereinMITSUI MINING & SMELTING CO LTD·Filed 2019·Granted Mar 19, 2024·0 cites·19 claims
- 2645US11876070B2Semiconductor package manufacturing methodMITSUI MINING & SMELTING CO LTD·Filed 2019·Granted Jan 16, 2024·0 cites·19 claims
- 2745US2024080990A1Wiring substrate, method of trimming same, and multi-layered wiring boardMITSUI MINING & SMELTING CO LTD·Filed 2021·Application pending·0 cites
- 2843US2024034670A1Carrier-attached metal foil and method for producing sameMITSUI MINING & SMELTING CO LTD·Filed 2021·Application pending·0 cites
- 2940US12302504B2Production method for multilayer wiring boardMITSUI MINING & SMELTING CO LTD·Filed 2016·Granted May 13, 2025·0 cites·14 claims
- 3040US2015001519A1Electrode Foil and Electronic DeviceMATSUURA YOSHINORI·Filed 2012·Application pending·0 cites
- 3135US6851310B2FlowmeterMITSUI MINING & SMELTING CO·Filed 2001·Granted Feb 8, 2005·0 cites·6 claims
- 3235US2011272768A1Lead Frame and Method of Producing Lead FrameSUN A CORP·Filed 2008·Application pending·0 cites
- 3332USD631943STank elementMITSUI MINING & SMELTING CO·Filed 2008·Granted Feb 1, 2011·1 cites·1 claims
- 3432USD631942STank elementMITSUI MINING & SMELTING CO·Filed 2008·Granted Feb 1, 2011·1 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →