Inventor · disambiguated record
Tomoya Nishida
Also filed as: NISHIDA TOMOYA
9 granted patents·5 pending applications·16 citations·filing 2004–2023
81Inventor score
Files withJTEKT CORP6SONY CORP4FUJIFILM BUSINESS INNOVATION CORP1SONY SEMICONDUCTOR SOLUTIONS CORP1TAMARI SHINICHI1
Top patents by PatentIndex Score
14 records- 0180US9885390B2Sliding shaft and steering deviceJTEKT CORP·Filed 2014·Granted Feb 6, 2018·2 cites·5 claims
- 0279US7579634B2Semiconductor device including a field effect transistorSONY CORP·Filed 2006·Granted Aug 25, 2009·9 cites·14 claims
- 0370US2019300650A1Resin pellet, resin pellet manufacturing method, and molded article manufacturing methodJTEKT CORP·Filed 2019·Application pending·0 cites
- 0461US8575658B2Semiconductor device and method for manufacturing sameTAMARI SHINICHI·Filed 2012·Granted Nov 5, 2013·2 cites·14 claims
- 0557US8378389B2Semiconductor device and method for manufacturing sameSONY CORP·Filed 2010·Granted Feb 19, 2013·1 cites·14 claims
- 0656US2017145159A1Resin pellet, resin pellet manufacturing method, and molded article manufacturing methodJTEKT CORP·Filed 2016·Application pending·0 cites
- 0755US7977198B2Semiconductor device and method of manufacturing semiconductor deviceSONY CORP·Filed 2009·Granted Jul 12, 2011·1 cites·5 claims
- 0853US2024282180A1Information processing apparatus, non-transitory computer readable medium, and information processing methodFUJIFILM BUSINESS INNOVATION CORP·Filed 2023·Application pending·0 cites
- 0949US10564185B2Prober and prober operation methodTOKYO SEIMITSU CO LTD·Filed 2018·Granted Feb 18, 2020·0 cites·13 claims
- 1049US9896637B2Sliding member, method of manufacturing sliding member, and gearJTEKT CORP·Filed 2016·Granted Feb 20, 2018·0 cites·4 claims
- 1147US10550285B2Method for manufacturing telescopic shaftJTEKT CORP·Filed 2014·Granted Feb 4, 2020·0 cites·4 claims
- 1245US2024347529A1Protection circuit and semiconductor deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 1344US7153710B2Etching method, method of manufacturing semiconductor device, and semiconductor deviceSONY CORP·Filed 2004·Granted Dec 26, 2006·1 cites·7 claims
- 1440US2015251399A1Resin coating forming method for spline shaft and spline shaftJTEKT CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →