Inventor · disambiguated record
Tomoo Nishiyama
Also filed as: NISHIYAMA TOMOO
6 granted patents·10 pending applications·5 citations·filing 2010–2023
71Inventor score
Files withHITACHI CHEMICAL CO LTD9NISHIYAMA TOMOO4KATAGI HIDEYUKI1RESONAC CORP1SHOWA DENKO MATERIALS CO LTD1
Top patents by PatentIndex Score
16 records- 0185US10988585B2Resin sheet and cured product of resin sheetHITACHI CHEMICAL CO LTD·Filed 2016·Granted Apr 27, 2021·2 cites·10 claims
- 0271US10851200B2Resin composition and method of producing laminateHITACHI CHEMICAL CO LTD·Filed 2019·Granted Dec 1, 2020·0 cites·6 claims
- 0368US2025282945A1Curable resin composition and electronic component deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 0466US2018009979A1Resin composition, resin sheet, and cured resin material and method for producing the sameHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 0564US10590232B2Resin composition and method of producing laminateHITACHI CHEMICAL CO LTD·Filed 2017·Granted Mar 17, 2020·0 cites·10 claims
- 0661US2014283972A1Resin composition, resin sheet, and cured resin material and method for producing the sameHITACHI CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 0758US9745411B2Resin composition, resin sheet, cured resin sheet, resin sheet structure, cured resin sheet structure, method for producing cured resin sheet structure, semiconductor device, and LED deviceHITACHI CHEMICAL CO LTD·Filed 2014·Granted Aug 29, 2017·1 cites·16 claims
- 0856US9349931B2Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for producing same, semiconductor device and LED deviceNISHIYAMA TOMOO·Filed 2012·Granted May 24, 2016·2 cites·24 claims
- 0948US2012251830A1Resin composition, resin sheet, and cured resin material and method for producing the sameNISHIYAMA TOMOO·Filed 2010·Application pending·0 cites
- 1045US2020324538A1Method of producing laminateHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 1136US11795293B2Epoxy resin, epoxy resin composition, resin sheet, B-stage sheet, C-stage sheet, cured product, metal foil with resin, metal substrate, and power semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 24, 2023·0 cites·14 claims
- 1235US2020163221A1Circuit board production method, circuit sheet and circuit boardHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 1335US2021206906A1Resin composition, resin member, resin sheet, b-stage sheet, c-stage sheet, metal foil with resin, metal substrate, and power semiconductor deviceSHOWA DENKO MATERIALS CO LTD·Filed 2018·Application pending·0 cites
- 1431US2012244351A1Multilayer resin sheet and method for producing the same, method for producing cured multilayer resin sheet, and highly thermally conductive resin sheet laminate and method for producing the sameKATAGI HIDEYUKI·Filed 2010·Application pending·0 cites
- 1530US2014079913A1Multilayer resin sheet, resin sheet laminate, cured multilayer resin sheet and method for producing same, multilayer resin sheet with metal foil, and semiconductor deviceNISHIYAMA TOMOO·Filed 2012·Application pending·0 cites
- 1629US2013189514A1Multilayer resin sheet and process for production thereof, resin sheet laminate and process for production thereof, cured multilayer resin sheet, metal-foil-cladded multilayer resin sheet, and semiconductor deviceNISHIYAMA TOMOO·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Tomoo Nishiyama files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →