Inventor · disambiguated record
Tomohiko Ogata
Also filed as: OGATA TOMOHIKO
10 granted patents·2 pending applications·85 citations·filing 1990–2019
85Inventor score
Top patents by PatentIndex Score
12 records- 0183US11002687B2Defect inspection method and defect inspection deviceHITACHI HIGH TECH CORP·Filed 2016·Granted May 11, 2021·2 cites·10 claims
- 0282US11193895B2Semiconductor substrate for evaluation and method using same to evaluate defect detection sensitivity of inspection deviceHITACHI HIGH TECH CORP·Filed 2017·Granted Dec 7, 2021·2 cites·15 claims
- 0370US10923315B2Charged particle beam apparatus, and method of adjusting charged particle beam apparatusHITACHI HIGH TECH CORP·Filed 2017·Granted Feb 16, 2021·1 cites·11 claims
- 0470US5030597AProcess for producing ceramic compositesTORAY INDUSTRIES·Filed 1990·Granted Jul 9, 1991·26 cites·22 claims
- 0565US6159322APhotosensitive ceramic green sheet, ceramic package, and process for producing the sameTORAY INDUSTRIES·Filed 1996·Granted Dec 12, 2000·35 cites·40 claims
- 0655US11515121B2Electron beam deviceHITACHI HIGH TECH CORP·Filed 2019·Granted Nov 29, 2022·0 cites·10 claims
- 0754US5957398AComposite ceramic materials as a pulverization medium and for working parts of a pulverizerTORAY INDUSTRIES·Filed 1997·Granted Sep 28, 1999·19 cites·30 claims
- 0845US11342211B2Wafer inspection apparatus and wafer inspection methodHITACHI HIGH TECH CORP·Filed 2018·Granted May 24, 2022·0 cites·10 claims
- 0945US10522320B2Charged particle beam device and method for adjusting charged particle beam deviceHITACHI HIGH TECH CORP·Filed 2016·Granted Dec 31, 2019·0 cites·9 claims
- 1044US11107655B2Charged particle beam deviceHITACHI HIGH TECH CORP·Filed 2017·Granted Aug 31, 2021·0 cites·14 claims
- 1135US2019079025A1Defect Inspection DeviceHITACHI HIGH TECH CORP·Filed 2016·Application pending·0 cites
- 1234US2006014979A1Process for producing terephthalic acidNUMATA MOTOKI·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →