Inventor · disambiguated record
Toshiyuki Ohta
Also filed as: OHTA TOSHIYUKI
19 granted patents·1 pending application·334 citations·filing 1980–2015
95Inventor score
Top patents by PatentIndex Score
20 records- 0195US4298962AMemoryNIPPON ELECTRIC CO·Filed 1980·Granted Nov 3, 1981·148 cites·8 claims
- 0280US6489389B1Rubber composition for tire treadsBRIDGESTONE CORP·Filed 1999·Granted Dec 3, 2002·39 cites·26 claims
- 0378US9732494B2Bucket and working vehicle provided with the sameKOMATSU MFG CO LTD·Filed 2015·Granted Aug 15, 2017·4 cites·8 claims
- 0468US9856625B2Working vehicleKOMATSU MFG CO LTD·Filed 2015·Granted Jan 2, 2018·2 cites·5 claims
- 0568US9719229B2Bucket and working vehicle provided with the sameKOMATSU MFG CO LTD·Filed 2015·Granted Aug 1, 2017·3 cites·5 claims
- 0661US6113750AMethod of forming thin metal filmsNEC CORP·Filed 1996·Granted Sep 5, 2000·26 cites·7 claims
- 0760US7949535B2User authentication system, fraudulent user determination method and computer program productFUJITSU LTD·Filed 2006·Granted May 24, 2011·4 cites·6 claims
- 0856US5801971AForm simulation device and its simulating method by the use of the Monte Carlo methodNEC CORP·Filed 1996·Granted Sep 1, 1998·21 cites·13 claims
- 0953US6361406B1Abrasion method of semiconductor deviceNEC CORP·Filed 2000·Granted Mar 26, 2002·5 cites·8 claims
- 1047US5751607AMethod of sputter deposition simulation by inverse trajectory calculationNEC CORP·Filed 1996·Granted May 12, 1998·20 cites·3 claims
- 1142US9534569B2Working vehicleKOMATSU MFG CO LTD·Filed 2015·Granted Jan 3, 2017·0 cites·7 claims
- 1242US6226768B1Coded frame synchronizing method and circuitFUJITSU LTD·Filed 1998·Granted May 1, 2001·10 cites·13 claims
- 1339US6199029B1Topography simulation method and system of plasma-assisted etching processNEC CORP·Filed 1998·Granted Mar 6, 2001·12 cites·4 claims
- 1436US5765128AApparatus for synchronizing a voice coder and a voice decoder of a vector-coding typeFUJITSU LTD·Filed 1995·Granted Jun 9, 1998·14 cites·10 claims
- 1536US2007088540A1Voice data processing method and deviceFUJITSU LTD·Filed 2006·Application pending·0 cites
- 1635US6070735ASputtering apparatus simulation methodNEC CORP·Filed 1998·Granted Jun 6, 2000·2 cites·9 claims
- 1735US5983011AMethod of simulating a profile of sputter deposition which covers a contact hole formed on a semiconductor waferNEC CORP·Filed 1997·Granted Nov 9, 1999·7 cites·9 claims
- 1835US5290015AMethod of producing high-melting-point and high-toughness metal and apparatus for the sameOSAKA TITANIUM·Filed 1992·Granted Mar 1, 1994·5 cites·7 claims
- 1934US5850356ASimulation apparatus for optimizing sputtering apparatus and simulation method thereforNEC CORP·Filed 1996·Granted Dec 15, 1998·7 cites·19 claims
- 2032US5815684AConfiguration simulating method employing string model for simulating layer configuration of silicon waferNEC CORP·Filed 1995·Granted Sep 29, 1998·5 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →