Inventor · disambiguated record
Toshiyuki Oshima
Also filed as: OSHIMA TOSHIYUKI
18 granted patents·4 pending applications·188 citations·filing 1992–2024
94Inventor score
Top patents by PatentIndex Score
22 records- 0189US6998175B2Heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2001·Granted Feb 14, 2006·42 cites·11 claims
- 0286US6488803B2Radiation-curable heat-peelable pressure-sensitive adhesive sheet and process for producing cut pieces with the sameNITTO DENKO CORP·Filed 2001·Granted Dec 3, 2002·37 cites·6 claims
- 0382US7175728B2Heat-peelable adhesive sheetNITTO DENKO CORP·Filed 2005·Granted Feb 13, 2007·7 cites·4 claims
- 0479US11276774B2Semiconductor device, inverter circuit, driving device, vehicle, and elevatorTOSHIBA KK·Filed 2019·Granted Mar 15, 2022·2 cites·12 claims
- 0578US7718257B2Heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2001·Granted May 18, 2010·14 cites·6 claims
- 0674US11276758B2Semiconductor device, inverter circuit, driving device, vehicle, and elevator having a reduced on-resistance with a silicon carbide layerTOSHIBA KK·Filed 2019·Granted Mar 15, 2022·1 cites·19 claims
- 0771US7163597B2Heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2003·Granted Jan 16, 2007·14 cites·4 claims
- 0867US2025078250A1Defect classification support apparatus, method, and non-transitory computer readable mediumTOSHIBA KK·Filed 2024·Application pending·0 cites
- 0963US7067030B2Heat-peelable adhesive sheetNITTO DENKO CORP·Filed 2003·Granted Jun 27, 2006·7 cites·6 claims
- 1061US7029550B2Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the sameNITTO DENKO CORORATION·Filed 2001·Granted Apr 18, 2006·8 cites·7 claims
- 1160US5192814AReaction injection molding polyurea resin compositionNIPPON PAINT CO LTD·Filed 1992·Granted Mar 9, 1993·12 cites·7 claims
- 1260US2024095520A1Representation learning apparatus, method, and non-transitory computer readable mediumTOSHIBA KK·Filed 2023·Application pending·0 cites
- 1358US7214424B2Heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2002·Granted May 8, 2007·6 cites·10 claims
- 1454US7147743B2Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the sameNITTO DENKO CORP·Filed 2001·Granted Dec 12, 2006·4 cites·7 claims
- 1552US5550198APolyurethane resin compositionNIPPON PAINT CO LTD·Filed 1994·Granted Aug 27, 1996·9 cites·13 claims
- 1650US5331051AReaction injection molding polyurea resin compositionNIPPON PAINT CO LTD·Filed 1992·Granted Jul 19, 1994·8 cites·8 claims
- 1750US2007111392A1Method for thermally releasing chip cut piece from thermal release type pressure sensitive adhesive sheet, electronic component and circuit boardNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 1846US11276751B2Semiconductor device, inverter circuit, driving device, vehicle, and elevatorTOSHIBA KK·Filed 2020·Granted Mar 15, 2022·0 cites·20 claims
- 1941US10770549B2Semiconductor device, inverter circuit, driving device, vehicle, and elevatorTOSHIBA KK·Filed 2019·Granted Sep 8, 2020·0 cites·20 claims
- 2040US2004177918A1Method of heat-peeling chip cut pieces from heat peel type adhesive sheet, electronic part, and circuit boardFiled 2002·Application pending·0 cites
- 2138US6127874ASkew adjustable IC and a method for designing the sameTOSHIBA KK·Filed 1997·Granted Oct 3, 2000·16 cites·12 claims
- 2230US5278226AStable polymer dispersions in polyoxyalkylenepolyamineNIPPON PAINT CO LTD·Filed 1992·Granted Jan 11, 1994·1 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →