Inventor · disambiguated record
Toshiyuki Ozai
Also filed as: OZAI TOSHIYUKI
35 granted patents·18 pending applications·137 citations·filing 1994–2023
96Inventor score
Top patents by PatentIndex Score
53 records- 0196US11417799B2Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plateSEMILEDS CORP·Filed 2020·Granted Aug 16, 2022·4 cites·20 claims
- 0291US6844393B2Heat-conductive silicone rubber compositionSHINETSU CHEMICAL CO·Filed 2003·Granted Jan 18, 2005·37 cites·15 claims
- 0386US11370869B2Ultraviolet curable silicone composition for stereolithography and cured product of sameSHINETSU CHEMICAL CO·Filed 2019·Granted Jun 28, 2022·3 cites·10 claims
- 0486US2024072203A1Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSEMILEDS CORP·Filed 2023·Application pending·0 cites
- 0585US12180320B2Ultraviolet curable silicone composition and cured product thereofSHINETSU CHEMICAL CO·Filed 2023·Granted Dec 31, 2024·0 cites·4 claims
- 0685US2024063339A1Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSAMILEDS CORP·Filed 2023·Application pending·0 cites
- 0782US6849755B2Organosilicon compoundSHINETSU CHEMICAL CO·Filed 2001·Granted Feb 1, 2005·11 cites·22 claims
- 0881US11862755B2Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plateSEMILEDS CORP·Filed 2022·Granted Jan 2, 2024·0 cites·5 claims
- 0980US11862754B2Method for fabricating (LED) dice using semiconductor structures on a substrate and laser lift-off to a receiving plateSEMILEDS CORP·Filed 2022·Granted Jan 2, 2024·0 cites·4 claims
- 1080US7915362B2Heat-curable silicone composition and light emitting diode element using sameSHINETSU CHEMICAL CO·Filed 2007·Granted Mar 29, 2011·9 cites·8 claims
- 1177US8592030B2Silicone adhesive for semiconductor elementSHINETSU CHEMICAL CO·Filed 2013·Granted Nov 26, 2013·2 cites·20 claims
- 1274US8142698B2Method for reducing a surface glossiness of an organopolysiloxane-cured articleOZAI TOSHIYUKI·Filed 2010·Granted Mar 27, 2012·2 cites·14 claims
- 1373US7737212B2Heat conductive silicone compositionSHINETSU CHEMICAL CO·Filed 2006·Granted Jun 15, 2010·2 cites·33 claims
- 1470US6699918B2Organopolysiloxane compositionSHINETSU CHEMICAL CO·Filed 2002·Granted Mar 2, 2004·8 cites·11 claims
- 1568US7456246B2Hydrophilic polyorganosiloxane compositionG C DENTAL IND CORP·Filed 2003·Granted Nov 25, 2008·8 cites·27 claims
- 1667US2021332175A1Ultraviolet curable silicone composition and cured product thereofSHINETSU CHEMICAL CO·Filed 2019·Application pending·0 cites
- 1765US2023049921A1Curable composition and ink for ink-jet printingSHINETSU CHEMICAL CO·Filed 2020·Application pending·0 cites
- 1864US2023340265A1Ultraviolet curable silicone composition and cured productSHINETSU CHEMICAL CO·Filed 2021·Application pending·0 cites
- 1963US12202925B2Organopolysiloxane, ultraviolet-curable silicone composition and cured productSHINETSU CHEMICAL CO·Filed 2020·Granted Jan 21, 2025·0 cites·6 claims
- 2062US8293810B2Rapid prototyping resin compositionsITO TAKASHI·Filed 2005·Granted Oct 23, 2012·12 cites·24 claims
- 2162US7879451B2Silicone rubber coating composition and airbagSHINETSU CHEMICAL CO·Filed 2007·Granted Feb 1, 2011·0 cites·4 claims
- 2262US2024191036A1Polysiloxane composition, adhesive, method for producing polysiloxane composition, and method for producing adhesiveUNIV KAGOSHIMA·Filed 2022·Application pending·0 cites
- 2361US7875695B2Hydrophilic organopolysiloxane composition for use as dental impression materialG C DENTAL IND CORP·Filed 2008·Granted Jan 25, 2011·0 cites·11 claims
- 2460US12139571B2Oxygen-curable silicone composition and cured product thereofSHINETSU CHEMICAL CO·Filed 2020·Granted Nov 12, 2024·0 cites·4 claims
- 2559US7563843B2Flame retardant silicone compositionsSHINETSU CHEMICAL CO·Filed 2003·Granted Jul 21, 2009·3 cites·6 claims
- 2658US12168745B2Ultraviolet ray curable silicone adhesive composition and cured product thereofSHINETSU CHEMICAL CO·Filed 2019·Granted Dec 17, 2024·0 cites·10 claims
- 2758US2023348758A1Addition-curing silicone pressure-sensitive adhesive composition and cured object obtained therefromSHINETSU CHEMICAL CO·Filed 2020·Application pending·0 cites
- 2858US2007287014A1Liquid organopolysiloxane composition for matting and cured article having a matted surfaceSHINETSU CHEMICAL CO·Filed 2007·Application pending·0 cites
- 2956US6306999B1Room temperature curable organopolysiloxane compositionSHINETSU CHEMICAL CO·Filed 1999·Granted Oct 23, 2001·16 cites·25 claims
- 3055US2022320366A1Method To Remove An Isolation Layer On The Corner Between The Semiconductor Light Emitting Device To The Growth SubstrateSEMILEDS CORP·Filed 2022·Application pending·0 cites
- 3154US12110426B2Ultraviolet ray-curable silicone adhesive agent composition, and method for producing laminateSHINETSU CHEMICAL CO·Filed 2019·Granted Oct 8, 2024·0 cites·5 claims
- 3253US5743951APrimer compositionSHINETSU CHEMICAL CO·Filed 1996·Granted Apr 28, 1998·11 cites·12 claims
- 3353US2009258216A1Silicone adhesive for semiconductor elementSHINETSU CHEMICAL CO·Filed 2009·Application pending·0 cites
- 3453US2023018855A1Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSEMILEDS CORP·Filed 2022·Application pending·0 cites
- 3551US12503600B2Thermally conductive silicone potting composition and cured product thereofSHINETSU CHEMICAL CO·Filed 2020·Granted Dec 23, 2025·0 cites·5 claims
- 3651US2024047243A1Microstructure-transfer stamp componentSHINETSU CHEMICAL CO·Filed 2021·Application pending·0 cites
- 3749US12398305B2Addition-curable silicone adhesive compositionSHINETSU CHEMICAL CO·Filed 2020·Granted Aug 26, 2025·0 cites·5 claims
- 3849US7045572B2Organosilicon compoundSHINETSU CHEMICAL CO·Filed 2004·Granted May 16, 2006·0 cites·6 claims
- 3948US7592069B2Silicone rubber coating composition and airbagSHINETSU CHEMICAL CO·Filed 2004·Granted Sep 22, 2009·2 cites·3 claims
- 4047US9796817B2Curable composition, semiconductor device, and ester bond-containing organosilicon compoundSHINETSU CHEMICAL CO·Filed 2014·Granted Oct 24, 2017·0 cites·20 claims
- 4147US2014203323A1Primer composition and optical semiconductor apparatus using sameSHINETSU CHEMICAL CO·Filed 2013·Application pending·0 cites
- 4246US2022315418A1Method for transferring microstructures, and method for mounting microstructuresSHINETSU CHEMICAL CO·Filed 2020·Application pending·0 cites
- 4345US9070846B2Primer composition and optical semiconductor apparatus using sameSHINETSU CHEMICAL CO·Filed 2014·Granted Jun 30, 2015·0 cites·24 claims
- 4444US2007290202A1Organosilicon compoundSHINETSU CHEMICAL CO·Filed 2007·Application pending·0 cites
- 4544US2017275406A1Uv curable silicone composition, cured product thereof, optical element encapsulation material comprised of the composition, and optical element encapsulated by the encapsulation materialSHINETSU CHEMICAL CO·Filed 2017·Application pending·0 cites
- 4642US2015102270A1Thermosetting conductive silicone composition, conductive adhesive comprising the same, conductive die bonding material comprising the same, and photosemiconductor apparatus having cured product of die bonding materialSHINETSU CHEMICAL CO·Filed 2014·Application pending·0 cites
- 4740US8957165B2Addition-curable silicone composition and optical elementSHINETSU CHEMICAL CO·Filed 2013·Granted Feb 17, 2015·0 cites·8 claims
- 4839US8809469B2Curable organopolysiloxane composition, optical device sealing material, and optical deviceSHINETSU CHEMICAL CO·Filed 2013·Granted Aug 19, 2014·0 cites·11 claims
- 4939US5362896ASilacyclo ring compound having alkenoxy groupsSHIN ETSU CHEMICAL CO INC·Filed 1994·Granted Nov 8, 1994·2 cites·8 claims
- 5038US5486567APrimer compositionsSHINETSU CHEMICAL CO·Filed 1995·Granted Jan 23, 1996·5 cites·6 claims
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →