Inventor · disambiguated record
Tobias Polster
Also filed as: POLSTER TOBIAS
7 granted patents·4 pending applications·3 citations·filing 2017–2024
74Inventor score
Files withINFINEON TECHNOLOGIES AG11
Top patents by PatentIndex Score
11 records- 0183US11302579B2Composite wafer, semiconductor device and electronic componentINFINEON TECHNOLOGIES AG·Filed 2020·Granted Apr 12, 2022·1 cites·5 claims
- 0279US10672664B2Composite wafer, semiconductor device, electronic component and method of manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 2, 2020·2 cites·14 claims
- 0377US12094837B2Method of manufacturing semiconductor devices by filling grooves formed in a front side surface of a wafer with a side face protection materialINFINEON TECHNOLOGIES AG·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 0477US2024371793A1Semiconductor device having a backside metallization layer and a protection layerINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0574US11848237B2Composite wafer, semiconductor device and electronic componentINFINEON TECHNOLOGIES AG·Filed 2022·Granted Dec 19, 2023·0 cites·10 claims
- 0669US11605599B2Semiconductor device having a thin semiconductor dieINFINEON TECHNOLOGIES AG·Filed 2020·Granted Mar 14, 2023·0 cites·11 claims
- 0761US2025096101A1Chip-substrate composite semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0858US12205919B2Method of processing a semiconductor wafer, semiconductor die, and method of producing a semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 21, 2025·0 cites·6 claims
- 0957US11322400B2Roughening of a metallization layer on a semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2020·Granted May 3, 2022·0 cites·12 claims
- 1053US2023097353A1Wafer, electronic component and method using lined and closed separation trenchINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1153US2025015008A1Die embedded package and method of forming a die embedded packageINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →