Inventor · disambiguated record
Toyoaki Sakai
Also filed as: SAKAI TOYOAKI
9 granted patents·3 pending applications·18 citations·filing 2004–2022
81Inventor score
Top patents by PatentIndex Score
12 records- 0173US8143533B2Method for forming resist pattern, method for producing circuit board, and circuit boardKANEDA YASUO·Filed 2006·Granted Mar 27, 2012·9 cites·4 claims
- 0267US7454832B2Method of forming metal plate pattern and circuit boardSHINKO ELECTRIC IND CO·Filed 2006·Granted Nov 25, 2008·4 cites·14 claims
- 0366US10170405B2Wiring substrate and semiconductor packageSHINKO ELECTRIC IND CO·Filed 2017·Granted Jan 1, 2019·1 cites·13 claims
- 0461US11818847B2Resist layer forming method, method for manufacturing wiring board, and resist layer forming apparatusSHINKO ELECTRIC IND CO·Filed 2022·Granted Nov 14, 2023·0 cites·7 claims
- 0560US7679004B2Circuit board manufacturing method and circuit boardSHINKO ELECTRIC IND CO·Filed 2005·Granted Mar 16, 2010·2 cites·3 claims
- 0659US12250773B2Wiring board and wiring board manufacturing methodSHINKO ELECTRIC IND CO·Filed 2022·Granted Mar 11, 2025·0 cites·24 claims
- 0746US2008197294A1Manufacturing method of circuit boardSHINKO ELECTRIC IND CO·Filed 2008·Application pending·0 cites
- 0845US7005241B2Process for making circuit board or lead frameSHINKO ELECTRIC IND CO·Filed 2004·Granted Feb 28, 2006·2 cites·19 claims
- 0944US2007017090A1Method of forming metal plate pattern and circuit boardSAKAI TOYOAKI·Filed 2006·Application pending·0 cites
- 1041US9699912B2Wiring boardSHINKO ELECTRIC IND CO·Filed 2016·Granted Jul 4, 2017·0 cites·19 claims
- 1138US2005124091A1Process for making circuit board or lead frameSHINKO ELECTRIC IND CO·Filed 2004·Application pending·0 cites
- 1236US9911695B2Wiring board including multiple wiring layers that are different in surface roughnessSHINKO ELECTRIC IND CO·Filed 2016·Granted Mar 6, 2018·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →