Inventor · disambiguated record
Toshiharu Sakurai
Also filed as: SAKURAI TOSHIHARU
9 granted patents·415 citations·filing 1982–1990
90Inventor score
Top patents by PatentIndex Score
9 records- 0198US5091341AMethod of sealing semiconductor device with resin by pressing a lead frame to a heat sink using an upper mold pressure memberTOSHIBA KK·Filed 1990·Granted Feb 25, 1992·273 cites·4 claims
- 0276US4855807ASemiconductor deviceTOSHIBA KK·Filed 1987·Granted Aug 8, 1989·47 cites·7 claims
- 0365US5198883ASemiconductor device having an improved lead arrangement and method for manufacturing the sameTOSHIBA KK·Filed 1989·Granted Mar 30, 1993·35 cites·13 claims
- 0455US4654692ASemiconductor device of resin-seal typeTOSHIBA KK·Filed 1986·Granted Mar 31, 1987·21 cites·5 claims
- 0547US5025347ASemiconductor deviceTOSHIBA KK·Filed 1989·Granted Jun 18, 1991·17 cites·3 claims
- 0639US4604642AFe-Ni-Cu leadframeTOSHIBA KK·Filed 1984·Granted Aug 5, 1986·9 cites·4 claims
- 0731US4910577ALead frameTOSHIBA KK·Filed 1988·Granted Mar 20, 1990·7 cites·4 claims
- 0828US5096081ACover plate for semiconductor devicesTOSHIBA KK·Filed 1989·Granted Mar 17, 1992·4 cites·4 claims
- 0928US4482611AElectronic partsTOKYO SHIBAURA ELECTRIC CO·Filed 1982·Granted Nov 13, 1984·2 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →