Inventor · disambiguated record
Toyomitsu Seki
Also filed as: SEKI TOYOMITSU
1 granted patent·8 pending applications·0 citations·filing 2021–2025
9Inventor score
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9 records- 0165US2025376584A1Resin composition, method for producing resin composition, pellet, molded article, and laminateDAIKIN IND LTD·Filed 2025·Application pending·0 cites
- 0264US12448514B2Resin composition and molded articleDAIKIN IND LTD·Filed 2021·Granted Oct 21, 2025·0 cites·10 claims
- 0363US2025223495A1Composition, molded body, laminate, and resinUNIV YAMAGATA NAT UNIV CORP·Filed 2025·Application pending·0 cites
- 0460US2023242771A1Composition for three-dimensional shaping and three-dimensional shaped objectDAIKIN IND LTD·Filed 2023·Application pending·0 cites
- 0560US2023174780A1Film, wrapping electric wire coating material, film for flexible printed circuit board, and laminateDAIKIN IND LTD·Filed 2023·Application pending·0 cites
- 0660US2023235182A1Powder composition, coating film, and three-dimensional shaped articleDAIKIN IND LTD·Filed 2023·Application pending·0 cites
- 0756US2025223494A1Composition, molded article, laminated body, and method for producing compositionDAIKIN IND LTD·Filed 2025·Application pending·0 cites
- 0855US2025153289A1Robot system, pressing automation system, program, and pressing-purpose jigDAIKIN IND LTD·Filed 2025·Application pending·0 cites
- 0951US2023260672A1Insulated electrical wire and resin compositionDAIKIN IND LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →