Inventor · disambiguated record
Tokiyuki Seto
Also filed as: SETO TOKIYUKI
3 granted patents·130 citations·filing 1987–1993
76Inventor score
Files withHITACHI LTD3
Top patents by PatentIndex Score
3 records- 0178US5431324AUltrasonic bonding apparatus and quality monitoring methodHITACHI LTD·Filed 1993·Granted Jul 11, 1995·69 cites·12 claims
- 0262US5323952ABonding apparatus and testing apparatus of a bonded portionHITACHI LTD·Filed 1992·Granted Jun 28, 1994·37 cites·10 claims
- 0362US4796132AThin film magnetic head having Au ultrasonic connection structureHITACHI LTD·Filed 1987·Granted Jan 3, 1989·24 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →