Inventor · disambiguated record
Toshihiro Shinohara
Also filed as: SHINOHARA TOSHIHIRO
11 granted patents·199 citations·filing 1981–2005
90Inventor score
Top patents by PatentIndex Score
11 records- 0194US4390895AColor image pick-up apparatusTOKYO SHIBAURA ELECTRIC CO·Filed 1981·Granted Jun 28, 1983·133 cites·9 claims
- 0277US6596947B1Board pieces, flexible wiring boards, and processes for manufacturing flexible wiring boardsSONY CHEMICALS CORP·Filed 2000·Granted Jul 22, 2003·22 cites·21 claims
- 0369US6912779B2Method of manufacturing flexible wiring boardSONY CHEMICALS CORP·Filed 2003·Granted Jul 5, 2005·14 cites·17 claims
- 0464US6562250B1Method for manufacturing wiring circuit boards with bumps and method for forming bumpsSONY CHEMICALS CORP·Filed 2000·Granted May 13, 2003·10 cites·3 claims
- 0563US7520053B2Method for manufacturing a bump-attached wiring circuit boardSONY CORP·Filed 2005·Granted Apr 21, 2009·2 cites·8 claims
- 0660US6437251B1Flexible board made by joining two pieces through an adhesive filmSONY CHEMICALS CORP·Filed 2000·Granted Aug 20, 2002·9 cites·4 claims
- 0754US6840430B2Board pieces, flexible wiring boards and processes for manufacturing flexible wiring boardsSONY CHEMICALS CORP·Filed 2003·Granted Jan 11, 2005·5 cites·16 claims
- 0849US6518510B2Bump-attached wiring circuit board and method for manufacturing sameSONY CHEMICALS CORP·Filed 2001·Granted Feb 11, 2003·3 cites·8 claims
- 0946US7098132B2Method of manufacturing flexible wiring boardSONY CORP·Filed 2005·Granted Aug 29, 2006·0 cites·10 claims
- 1044US7020961B2Method for manufacturing a bump-attached wiring circuit boardSONY CORP·Filed 2002·Granted Apr 4, 2006·1 cites·8 claims
- 1141US6977349B2Method for manufacturing wiring circuit boards with bumps and method for forming bumpsSONY CHEMICALS CORP·Filed 2003·Granted Dec 20, 2005·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →