Inventor · disambiguated record
Toshio Shiobara
Also filed as: SHIOBARA TOSHIO
192 granted patents·43 pending applications·2,656 citations·filing 1974–2025
99Inventor score
Files withSHINETSU CHEMICAL CO201SHIOBARA TOSHIO5KASHIWAGI TSUTOMU4MITSUBISHI ELECTRIC CORP3HOKKO CHEM IND CO2
Top patents by PatentIndex Score
235 records- 0197US12477709B2Electromagnetic wave shielding sheetSHINETSU CHEMICAL CO·Filed 2023·Granted Nov 18, 2025·1 cites·14 claims
- 0296US7858198B2Phosphor-containing adhesive silicone composition, composition sheet formed of the composition, and method of producing light emitting device using the sheetSHINETSU CHEMICAL CO·Filed 2008·Granted Dec 28, 2010·40 cites·7 claims
- 0395US6806509B2Light-emitting semiconductor potting composition and light-emitting semiconductor deviceSHINETSU CHEMICAL CO·Filed 2004·Granted Oct 19, 2004·111 cites·5 claims
- 0493US7026382B2Conductive resin compositionSHINETSU CHEMICAL CO·Filed 2003·Granted Apr 11, 2006·47 cites·8 claims
- 0592US4877822AEpoxy resin compositionSHINETSU CHEMICAL CO·Filed 1988·Granted Oct 31, 1989·42 cites·6 claims
- 0690US7737194B2Silicone lens and silicone resin composition for molding lensSHINETSU CHEMICAL CO·Filed 2007·Granted Jun 15, 2010·9 cites·4 claims
- 0790US7705093B2Phosphor-filled curable silicone resin composition and cured product thereofSHINETSU CHEMICAL CO·Filed 2007·Granted Apr 27, 2010·11 cites·19 claims
- 0890US6376923B1Flip-chip type semiconductor device sealing material and flip-chip type semiconductor deviceSHINETSU CHEMICAL CO·Filed 2000·Granted Apr 23, 2002·38 cites·17 claims
- 0990US4902732AEpoxy resin-based curable compositionsSHINETSU CHEMICAL CO·Filed 1986·Granted Feb 20, 1990·60 cites·13 claims
- 1089US11920011B2Resin substrate having dielectric characteristics with little frequency dependenceSHINETSU CHEMICAL CO·Filed 2022·Granted Mar 5, 2024·1 cites·11 claims
- 1189US11802192B2Low dielectric resin substrateSHINETSU CHEMICAL CO·Filed 2021·Granted Oct 31, 2023·1 cites·10 claims
- 1289US7276562B2Epoxy-silicone mixed resin composition and light-emitting semiconductor deviceSHINETSU CHEMICAL CO·Filed 2005·Granted Oct 2, 2007·18 cites·9 claims
- 1389US5290882AThermosetting resin compositionsSHINETSU CHEMICAL CO·Filed 1992·Granted Mar 1, 1994·51 cites·10 claims
- 1489US4011247AMethod for the preparation of an organohydrogenpolysiloxane as a product of a partial addition reactionSHINETSU CHEMICAL CO·Filed 1974·Granted Mar 8, 1977·38 cites·6 claims
- 1589US3974122AHeat-curable silicone resin compositionsSHINETSU CHEMICAL CO·Filed 1975·Granted Aug 10, 1976·48 cites·18 claims
- 1688US8933158B2Thermosetting silicone resin composition for reflector of LED, reflector for LED using the same and optical semiconductor apparatusSHINETSU CHEMICAL CO·Filed 2013·Granted Jan 13, 2015·11 cites·11 claims
- 1788US6225704B1Flip-chip type semiconductor deviceSHINETSU CHEMICAL CO·Filed 2000·Granted May 1, 2001·55 cites·2 claims
- 1887US6323263B1Semiconductor sealing liquid epoxy resin compositionsSHINETSU CHEMICAL CO·Filed 2000·Granted Nov 27, 2001·32 cites·2 claims
- 1986US8173759B2Organopolysilmethylene and a composition comprising the sameKASHIWAGI TSUTOMU·Filed 2010·Granted May 8, 2012·4 cites·10 claims
- 2086US6512031B1Epoxy resin composition, laminate film using the same, and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2000·Granted Jan 28, 2003·47 cites·8 claims
- 2186US5198479ALight transmissive epoxy resin compositions and optical semiconductor devices encapsulated therewithSHINETSU CHEMICAL CO·Filed 1991·Granted Mar 30, 1993·86 cites·9 claims
- 2286US5137940ASemiconductor encapsulating epoxy resin compositionsSHINETSU CHEMICAL CO·Filed 1990·Granted Aug 11, 1992·49 cites·4 claims
- 2385US6372839B1Flip-chip type semiconductor device underfillSHINETSU CHEMICAL CO·Filed 2000·Granted Apr 16, 2002·21 cites·8 claims
- 2483US12441892B2Low dielectric silica powder, resin composition containing the silica powder, and method for manufacturing low dielectric silica powderSHINETSU CHEMICAL CO·Filed 2024·Granted Oct 14, 2025·0 cites·10 claims
- 2583US9117978B2Thermosetting silicone resin sheet and method for producing the same, and light-emitting apparatus using the thermosetting silicone resin sheet and method for producing the sameSHINETSU CHEMICAL CO·Filed 2013·Granted Aug 25, 2015·3 cites·14 claims
- 2683US7985806B2Diglycidylisocyanuryl-modified organopolysiloxane and composition containing the sameSHINETSU CHEMICAL CO·Filed 2009·Granted Jul 26, 2011·5 cites·15 claims
- 2783US6294271B1Flip-chip type semiconductor device sealing material and flip-chip type semiconductor deviceSHINETSU CHEMICAL CO·Filed 2000·Granted Sep 25, 2001·37 cites·3 claims
- 2883US4859722AEpoxy resin compositionSHINETSU CHEMICAL CO·Filed 1988·Granted Aug 22, 1989·34 cites·17 claims
- 2982US8846420B2Surface-mount light emitting deviceSHINETSU CHEMICAL CO·Filed 2013·Granted Sep 30, 2014·5 cites·2 claims
- 3082US7521813B2Silicone rubber composition, light-emitting semiconductor embedding/protecting material and light-emitting semiconductor deviceSHIN ESTU CHEMICAL CO LTD·Filed 2004·Granted Apr 21, 2009·32 cites·7 claims
- 3182US5336786AOrganic silicon compoundsSHINETSU CHEMICAL CO·Filed 1993·Granted Aug 9, 1994·24 cites·6 claims
- 3281US8319242B2Light-emitting semiconductor device, mounted substrate, and fabrication method thereofSHIOBARA TOSHIO·Filed 2011·Granted Nov 27, 2012·6 cites·26 claims
- 3381US8088856B2Heat-curable resin compositionSHIOBARA TOSHIO·Filed 2009·Granted Jan 3, 2012·4 cites·10 claims
- 3481US7829651B2Lens-forming silicone resin composition and silicone lensSHINETSU CHEMICAL CO·Filed 2006·Granted Nov 9, 2010·9 cites·7 claims
- 3581US6479167B2Sealing material for flip-chip semiconductor device, and flip-chip semiconductor device made therewithSHINETSU CHEMICAL CO·Filed 2001·Granted Nov 12, 2002·31 cites·16 claims
- 3680US8124715B2Isocyanuric ring-containing polysiloxane having vinyl groups at the terminalsTANAKA HAYATO·Filed 2010·Granted Feb 28, 2012·9 cites·3 claims
- 3780US6310120B1Flip-chip type semiconductor device sealing materialSHINETSU CHEMICAL CO·Filed 2000·Granted Oct 30, 2001·16 cites·5 claims
- 3880US5175199AHigh transparency silica-titania glass beads, method for making, and light transmission epoxy resin compositionsSHINETSU CHEMICAL CO·Filed 1991·Granted Dec 29, 1992·47 cites·6 claims
- 3979US10177059B2Method for manufacturing semiconductor apparatus using a base-attached encapsulantSHINETSU CHEMICAL CO·Filed 2017·Granted Jan 8, 2019·2 cites·4 claims
- 4079US8034893B2Resin resolution composition, polyimide resin, and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2006·Granted Oct 11, 2011·9 cites·12 claims
- 4179US7807736B2Semiconductor device encapsulated by silicone resin composition, and silicone resin tablet for encapsulating semiconductor deviceSHINETSU CHEMICAL CO·Filed 2007·Granted Oct 5, 2010·8 cites·4 claims
- 4279US7563854B2Method of producing high molecular weight organopolysiloxane, composition comprising the high molecular weight organopolysiloxane, and optical semiconductor device sealed with cured product thereofSHINETSU CHEMICAL CO·Filed 2006·Granted Jul 21, 2009·3 cites·9 claims
- 4379US5298548AEpoxy resin composition and semiconductor devices encapsulated therewithSHINETSU CHEMICAL CO·Filed 1992·Granted Mar 29, 1994·33 cites·15 claims
- 4478US11678432B2Low dielectric substrate for high-speed millimeter-wave communicationSHINETSU CHEMICAL CO·Filed 2022·Granted Jun 13, 2023·0 cites·6 claims
- 4578US8133957B2Resin composition for encapsulating optical semiconductor elementHAMAMOTO YOSHIHIRA·Filed 2009·Granted Mar 13, 2012·3 cites·9 claims
- 4678US6569532B2Epoxy resin compositions and premolded semiconductor packagesSONY CORP·Filed 2001·Granted May 27, 2003·27 cites·13 claims
- 4778US6429238B1Flip-chip type semiconductor device sealing material and flip-chip type semiconductor deviceSHINETSU CHEMICAL CO·Filed 2000·Granted Aug 6, 2002·28 cites·6 claims
- 4878US5994785AEpoxy resin compositions and semiconductor devices encapsulated therewithMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Nov 30, 1999·70 cites·4 claims
- 4978US5940688AEpoxy resin composition and semiconductor device encapsulated therewithSHINETSU CHEMICAL CO·Filed 1997·Granted Aug 17, 1999·57 cites·10 claims
- 5077US7683152B2Partial block polyimide-polysiloxane copolymer, making method, and resin composition comprising the copolymerSHINETSU CHEMICAL CO·Filed 2005·Granted Mar 23, 2010·4 cites·5 claims
Showing the top 50 of 235 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →