Inventor · disambiguated record
Tomoko Takizawa
Also filed as: TAKIZAWA TOMOKO
3 granted patents·4 pending applications·132 citations·filing 2000–2005
74Inventor score
Top patents by PatentIndex Score
7 records- 0189US6611063B1Resin-encapsulated semiconductor deviceNEC ELECTRONICS CORP·Filed 2000·Granted Aug 26, 2003·89 cites·1 claims
- 0282US6504244B2Semiconductor device and semiconductor module using the sameNEC CORP·Filed 2001·Granted Jan 7, 2003·41 cites·42 claims
- 0347US6486553B1Semiconductor device with increased connection strength between solder balls and wiring layerNEC CORP·Filed 2000·Granted Nov 26, 2002·2 cites·20 claims
- 0441US2009214629A1Gene transfer methodMEBIOPHARM CO LTD·Filed 2005·Application pending·0 cites
- 0537US2002000651A1Semiconductor device and method of fabricating the sameFiled 2001·Application pending·0 cites
- 0634US2003119296A1Semiconductor device and manufacturing method for the sameFiled 2002·Application pending·0 cites
- 0732US2009110643A1Method of Producing Liposomes Containing Gas Enclosed ThereinMEBIOPHARM CO LTD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →