Inventor · disambiguated record
Toshihiko Toyama
Also filed as: TOYAMA TOSHIHIKO
10 granted patents·6 pending applications·176 citations·filing 2000–2021
87Inventor score
Top patents by PatentIndex Score
16 records- 0197US7621436B2Wire bonding methodSHINKAWA KK·Filed 2006·Granted Nov 24, 2009·128 cites·11 claims
- 0286US12087725B2Wire bonding apparatus, method for measuring opening amount of clamp apparatus, and method for calibrating clamp apparatusSHINKAWA KK·Filed 2020·Granted Sep 10, 2024·2 cites·8 claims
- 0376US6491202B1Wire bonding apparatus and methodSHINKAWA KK·Filed 2000·Granted Dec 10, 2002·23 cites·2 claims
- 0475US8191759B2Wire bonding apparatus and wire bonding methodTEI SHINSUKE·Filed 2011·Granted Jun 5, 2012·6 cites·5 claims
- 0569US7808116B2Semiconductor device and wire bonding methodSHINKAWA KK·Filed 2008·Granted Oct 5, 2010·5 cites·15 claims
- 0664US6467679B2Wire bonding methodSHINKAWA KK·Filed 2001·Granted Oct 22, 2002·11 cites·1 claims
- 0755US8678266B2Wire bonding methodMII TATSUNARI·Filed 2006·Granted Mar 25, 2014·1 cites·17 claims
- 0850US12374653B2Manufacturing method of semiconductor device and wire bonding apparatusSHINKAWA KK·Filed 2021·Granted Jul 29, 2025·0 cites·8 claims
- 0948US12191173B2Wire tension adjustment method and wire tension adjusterSHINKAWA KK·Filed 2021·Granted Jan 7, 2025·0 cites·14 claims
- 1048US2024379613A1Pin wire forming method, wire bonding apparatus, and bonding toolSHINKAWA KK·Filed 2021·Application pending·0 cites
- 1147US7910472B2Method of manufacturing semiconductor deviceSHINKAWA KK·Filed 2010·Granted Mar 22, 2011·0 cites·7 claims
- 1246US2006175383A1Wire bonding methodSHINKAWA KK·Filed 2006·Application pending·0 cites
- 1342US2007187467A1Method for forming a stud bumpSHINKAWA KK·Filed 2007·Application pending·0 cites
- 1442US2016358883A1Bump forming method, bump forming apparatus, and semiconductor device manufacturing methodSHINKAWA KK·Filed 2016·Application pending·0 cites
- 1538US2016020345A1Method and device of manufacturing compound-semiconductor thin-filmUNIV OSAKA·Filed 2014·Application pending·0 cites
- 1636US2010155455A1Wire bonding methodSHINKAWA KK·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →