Inventor · disambiguated record
Toshihiko Tsujikawa
Also filed as: TSUJIKAWA TOSHIHIKO
21 granted patents·1 pending application·210 citations·filing 1993–2017
94Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD8PANASONIC CORP6PANASONIC IP MAN CO LTD4IWAHASHI TAKASHI2TSUBOI YASUTAKA2
Top patents by PatentIndex Score
22 records- 0178US5991435AInspecting apparatus of mounting state of component or printing state of cream solder in mounting line of electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Nov 23, 1999·43 cites·10 claims
- 0276US7850800B2Bonding sheet applying apparatus and methodPANASONIC CORP·Filed 2006·Granted Dec 14, 2010·6 cites·4 claims
- 0376US6445813B1System for inspecting an apparatus of a printed circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Sep 3, 2002·21 cites·17 claims
- 0473US9036022B2Component mounting apparatus, illuminating apparatus used in imaging and illuminating methodTSUBOI YASUTAKA·Filed 2011·Granted May 19, 2015·6 cites·6 claims
- 0573US5555316AInspecting apparatus of mounting state of component or printing state of cream solder in mounting line of electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Sep 10, 1996·51 cites·2 claims
- 0672US9739300B2Component crimping apparatusPANASONIC IP MAN CO LTD·Filed 2015·Granted Aug 22, 2017·2 cites·3 claims
- 0771US10058019B2Bonding apparatusPANASONIC CORP·Filed 2014·Granted Aug 21, 2018·2 cites·3 claims
- 0863US5724439AInspecting apparatus of mounted componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Mar 3, 1998·33 cites·2 claims
- 0959US6081613ASystem for inspecting an appearance of a printed circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Jun 27, 2000·23 cites·2 claims
- 1058US6167149AInspecting apparatus of mounting state of component or printing state of cream solder in mounting line of electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Dec 26, 2000·18 cites·2 claims
- 1154US8285028B2Inspection apparatus and inspection methodIWAHASHI TAKASHI·Filed 2008·Granted Oct 9, 2012·2 cites·14 claims
- 1253US6512363B1Method and apparatus for automatic registration of a boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Jan 28, 2003·2 cites·4 claims
- 1352US6707289B2Method and apparatus for automatic registration for a boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Mar 16, 2004·1 cites·3 claims
- 1451US9703129B2Component mounting apparatusPANASONIC CORP·Filed 2014·Granted Jul 11, 2017·0 cites·9 claims
- 1550US9547190B2Component mounting apparatusPANASONIC CORP·Filed 2014·Granted Jan 17, 2017·0 cites·3 claims
- 1645US7708848B2Component bonding method and component bonding devicePANASONIC CORP·Filed 2007·Granted May 4, 2010·0 cites·12 claims
- 1743US9673165B2Component mounting apparatusPANASONIC CORP·Filed 2014·Granted Jun 6, 2017·0 cites·5 claims
- 1840US10813227B2Component mounter and mounting board manufacturing methodPANASONIC IP MAN CO LTD·Filed 2017·Granted Oct 20, 2020·0 cites·7 claims
- 1939US9842824B2Component mounting apparatusPANASONIC IP MAN CO LTD·Filed 2015·Granted Dec 12, 2017·0 cites·5 claims
- 2038US8300921B2Inspection apparatus and inspection methodIWAHASHI TAKASHI·Filed 2009·Granted Oct 30, 2012·0 cites·11 claims
- 2137US9872395B2Component crimping apparatusPANASONIC IP MAN CO LTD·Filed 2015·Granted Jan 16, 2018·0 cites·1 claims
- 2234US2012262567A1Component mounting apparatus, illuminating apparatus used in imaging and illuminating methodTSUBOI YASUTAKA·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →