Inventor · disambiguated record
Toyotaka Wada
Also filed as: WADA TOYOTAKA
9 granted patents·190 citations·filing 1996–2000
90Inventor score
Top patents by PatentIndex Score
9 records- 0187US5799643ASlurry managing system and slurry managing method for wire sawsNIPPEI TOYAMA CORP·Filed 1996·Granted Sep 1, 1998·67 cites·25 claims
- 0274US6332834B1Method and apparatus for grinding a workpieceNIPPEI TOYAMA CORP·Filed 2000·Granted Dec 25, 2001·18 cites·23 claims
- 0372US6161533ASlurry managing system and slurry managing methodNIPPEI TOYOMA CORP·Filed 1999·Granted Dec 19, 2000·38 cites·35 claims
- 0464US6053158ASlurry managing system and slurry managing method for wire sawsNIPPEI TOYOMA CORP·Filed 1998·Granted Apr 25, 2000·24 cites·25 claims
- 0558US6722956B2Working apparatusNIPPEI TOYAMA CORP·Filed 2000·Granted Apr 20, 2004·9 cites·21 claims
- 0644US6296553B1Grinding method, surface grinder, workpiece support, mechanism and work restNIPPEI TOYAMA CORP·Filed 1998·Granted Oct 2, 2001·11 cites·39 claims
- 0742US6220931B1Feeding a grinding wheel in grinding methodNIPPEI TOYAMA CORP·Filed 1999·Granted Apr 24, 2001·8 cites·6 claims
- 0839US6036585AGrinder and grinding methodNIPPEI TOYAMA CORP·Filed 1998·Granted Mar 14, 2000·7 cites·26 claims
- 0938US6113489AIngot slicing method, an ingot manufacturing method and a sliced ingot grinding apparatusNIPPEI TOYAMA CORP·Filed 1999·Granted Sep 5, 2000·8 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →