Inventor · disambiguated record
Tomohisa Yagi
Also filed as: YAGI TOMOHISA
7 granted patents·5 pending applications·47 citations·filing 2002–2015
82Inventor score
Top patents by PatentIndex Score
12 records- 0182US6670264B2Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made therebyFUJITSU LTD·Filed 2002·Granted Dec 30, 2003·26 cites·36 claims
- 0278US8152953B2Method of making printed wiring board and method of making printed circuit board unitYOSHIMURA HIDEAKI·Filed 2009·Granted Apr 10, 2012·8 cites·6 claims
- 0367US6790881B2Adhesive compositionFUJITSU LTD·Filed 2002·Granted Sep 14, 2004·6 cites·15 claims
- 0458US7943001B2Process for producing multilayer boardFUJITSU LTD·Filed 2007·Granted May 17, 2011·1 cites·4 claims
- 0551US6873056B2Electrode-to-electrode bond structureFUJITSU LTD·Filed 2003·Granted Mar 29, 2005·3 cites·3 claims
- 0650US2009294160A1Method of making printed wiring board and electrically-conductive binderFUJITSU LTD·Filed 2009·Application pending·0 cites
- 0747US8725378B2Control system for vehicle and method of controlling vehicleNAKAMURA TAKU·Filed 2012·Granted May 13, 2014·0 cites·8 claims
- 0847US6869822B2Method of making a semiconductor device with adhesive sealing subjected to two-fold hardeningFUJITSU LTD·Filed 2002·Granted Mar 22, 2005·3 cites·13 claims
- 0940US2005110169A1Semiconductor device and method of making the sameFUJITSU LTD·Filed 2004·Application pending·0 cites
- 1039US2005001014A1Method of mounting electronic part and flux-fillFUJITSU LTD·Filed 2004·Application pending·0 cites
- 1136US2011100690A1Electrically conductive body and printed wiring board and method of making the sameFUJITSU LTD·Filed 2010·Application pending·0 cites
- 1236US2016066421A1Solder paste and electronic partFUJITSU LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →