Inventor · disambiguated record
Tomohisa Yamane
Also filed as: YAMANE TOMOHISA
4 granted patents·2 pending applications·0 citations·filing 2019–2022
52Inventor score
Files withMITSUBISHI ELECTRIC CORP6
Top patents by PatentIndex Score
6 records- 0155US12469761B2Power module including highly-heat-dissipating insulation adhesive sheetMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Nov 11, 2025·0 cites·10 claims
- 0251US12506052B2Semiconductor device and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Dec 23, 2025·0 cites·13 claims
- 0351US2023135461A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 0450US12094798B2Power semiconductor device including a deformable flow blocking member between a module unit and a cooling unitMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Sep 17, 2024·0 cites·18 claims
- 0544US2023154820A1Power semiconductor device and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 0637US12074082B2Semiconductor module and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Aug 27, 2024·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →