Inventor · disambiguated record
Tomohiro Yokochi
Also filed as: TERAMAE TAKEHITO · YOKOCHI TOMOHIRO
17 granted patents·4 pending applications·362 citations·filing 2000–2025
95Inventor score
Top patents by PatentIndex Score
21 records- 0191US7378745B2Package substrate for a semiconductor device having thermoplastic resin layers and conductive patternsNEC ELECTRONICS CORP·Filed 2005·Granted May 27, 2008·39 cites·21 claims
- 0291US6641898B2Printed wiring board and method of manufacturing a printed wiring boardDENSO CORP·Filed 2001·Granted Nov 4, 2003·51 cites·8 claims
- 0391US6449836B1Method for interconnecting printed circuit boards and interconnection structureDENSO CORP·Filed 2000·Granted Sep 17, 2002·78 cites·29 claims
- 0490US6680441B2Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric deviceDENSO CORP·Filed 2002·Granted Jan 20, 2004·44 cites·24 claims
- 0580US6713687B2Printed wiring board and method for manufacturing printed wiring boardDENSO CORP·Filed 2001·Granted Mar 30, 2004·24 cites·12 claims
- 0675US6966482B2Connecting structure of printed circuit boardsDENSO CORP·Filed 2003·Granted Nov 22, 2005·17 cites·10 claims
- 0774US7323238B2Printed circuit board having colored outer layerDENSO CORP·Filed 2005·Granted Jan 29, 2008·7 cites·14 claims
- 0874US7165321B2Method for manufacturing printed wiring board with embedded electric deviceDENSO CORP·Filed 2003·Granted Jan 23, 2007·15 cites·7 claims
- 0974US7036214B2Manufacturing method of rigid-flexible printed circuit board and structure thereofDENSO CORP·Filed 2003·Granted May 2, 2006·19 cites·11 claims
- 1074US6667443B2Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing methodDENSO CORP·Filed 2001·Granted Dec 23, 2003·18 cites·13 claims
- 1172US7188412B2Method for manufacturing printed wiring boardDENSO CORP·Filed 2003·Granted Mar 13, 2007·15 cites·9 claims
- 1272US6527162B2Connecting method and connecting structure of printed circuit boardsDENSO CORP·Filed 2001·Granted Mar 4, 2003·15 cites·14 claims
- 1372US2025259902A1Semiconductor package, electronic device, and method for manufacturing semiconductor packageDENSO CORP·Filed 2025·Application pending·0 cites
- 1472US2025253198A1Semiconductor package, electronic device, and method for manufacturing semiconductor packageDENSO CORP·Filed 2025·Application pending·0 cites
- 1569US6972070B2Method of manufacturing a printed wiring boardDENSO CORP·Filed 2003·Granted Dec 6, 2005·12 cites·3 claims
- 1664US12400923B2Semiconductor package, electronic device, and method for manufacturing semiconductor packageDENSO CORP·Filed 2021·Granted Aug 26, 2025·0 cites·17 claims
- 1760US12501867B2Control device and non-transitory computer readable mediumDENSO CORP·Filed 2023·Granted Dec 23, 2025·0 cites·20 claims
- 1857US6855625B2Manufacturing method of multilayer substrateDENSO CORP·Filed 2003·Granted Feb 15, 2005·6 cites·27 claims
- 1947US7061599B2Protective film for base substrates of multi-layered board and method and apparatus for inspecting base substratesDENSO CORP·Filed 2003·Granted Jun 13, 2006·2 cites·13 claims
- 2036US2018242464A1Multilayer substrate and method for manufacturing the sameDENSO CORP·Filed 2016·Application pending·0 cites
- 2131US2020258805A1Electronic component module provided with substrate on which electronic components are mounted and heat sink and manufacturing method of the sameDENSO CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →