Inventor · disambiguated record
Tracy Autry
Also filed as: AUTRY TRACY · AUTRY TRACY A
11 granted patents·2 pending applications·55 citations·filing 1996–2012
87Inventor score
Top patents by PatentIndex Score
13 records- 0166US7435993B2High temperature, high voltage SiC void-less electronic packageMICROSEMI CORP·Filed 2007·Granted Oct 14, 2008·4 cites·20 claims
- 0264US8587107B2Silicon carbide semiconductorAUTRY TRACY·Filed 2010·Granted Nov 19, 2013·2 cites·11 claims
- 0364US8237171B2High voltage high package pressure semiconductor packageAUTRY TRACY·Filed 2010·Granted Aug 7, 2012·2 cites·19 claims
- 0461US8274164B2Less expensive high power plastic surface mount packageAUTRY TRACY·Filed 2009·Granted Sep 25, 2012·2 cites·13 claims
- 0561US5821617ASurface mount package with low coefficient of thermal expansionMICROSEMI CORP·Filed 1996·Granted Oct 13, 1998·29 cites·13 claims
- 0657US8003446B2Flexible diode package and method of manufacturingMICROSEMI CORP·Filed 2009·Granted Aug 23, 2011·1 cites·20 claims
- 0756US8018042B2Integrated circuit with flexible planar leadsMICROSEMI CORP·Filed 2008·Granted Sep 13, 2011·1 cites·10 claims
- 0847US2013023089A1Less expensive high power plastic surface mount packageMICROSEMI CORP·Filed 2012·Application pending·0 cites
- 0943US8058719B2Integrated circuit with flexible planer leadsAUTRY TRACY·Filed 2007·Granted Nov 15, 2011·0 cites·19 claims
- 1040US7741706B2Plastic surface mount large area power deviceMICROSEMI CORP·Filed 2006·Granted Jun 22, 2010·0 cites·18 claims
- 1139US5923083APackaging technology for Schottky dieMICROSEMI CORP·Filed 1997·Granted Jul 13, 1999·10 cites·8 claims
- 1238US2012326323A1High voltage high package pressure semiconductor packageAUTRY TRACY·Filed 2012·Application pending·0 cites
- 1324US6294766B1Battery cell bypass with pre-loaded compression actionMICROSEMI CORP·Filed 1999·Granted Sep 25, 2001·4 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →