Inventor · disambiguated record
Travis M. Jensen
Also filed as: JENSEN TRAVIS M · JENSEN TRAVIS MICHAEL
11 granted patents·6 pending applications·14 citations·filing 2017–2025
85Inventor score
Files withMICRON TECHNOLOGY INC17
Top patents by PatentIndex Score
17 records- 0195US11233024B2Methods for forming substrate terminal pads, related terminal pads and substrates and assemblies incorporating such terminal padsMICRON TECHNOLOGY INC·Filed 2020·Granted Jan 25, 2022·4 cites·15 claims
- 0292US11594432B2Cold fluid semiconductor device release during pick and place operations, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 28, 2023·2 cites·19 claims
- 0392US2025372581A1Semiconductor devices with redistribution structures configured for switchable routingMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0490US10090177B1Cold fluid semiconductor device release during pick and place operations, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 2, 2018·5 cites·10 claims
- 0588US11171121B2Semiconductor devices with redistribution structures configured for switchable routingMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 9, 2021·2 cites·20 claims
- 0682US12394757B2Semiconductor devices with redistribution structures configured for switchable routingMICRON TECHNOLOGY INC·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 0780US2025374430A1Substrates with continuous slot viasMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0876US10410891B2Cold fluid semiconductor device release during pick and place operations, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Sep 10, 2019·1 cites·16 claims
- 0975US2024258256A1Assembly including terminal pads associated with conductive traces and having irregular surface topography, and related methods and electronic systemsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1073US11791316B2Semiconductor devices with redistribution structures configured for switchable routingMICRON TECHNOLOGY INC·Filed 2021·Granted Oct 17, 2023·0 cites·19 claims
- 1172US11967572B2Apparatus including a terminal pad associated with a conductive trace and having an irregular surface topographyMICRON TECHNOLOGY INC·Filed 2022·Granted Apr 23, 2024·0 cites·7 claims
- 1267US12396097B2Substrates with continuous slot viasMICRON TECHNOLOGY INC·Filed 2022·Granted Aug 19, 2025·0 cites·20 claims
- 1364US10998208B2Cold fluid semiconductor device release during pick and place operations, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted May 4, 2021·0 cites·17 claims
- 1461US2025046710A1Device packages including command/address connections, and related electronic systemsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1560US2024355748A1High-performance semiconductor fan out packageMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1654US2024206069A1Printed circuit board over printed circuit board assemblyMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1751US12230608B2Semiconductor assemblies with system and methods for conveying signals using through mold viasMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 18, 2025·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →