Inventor · disambiguated record
Tracy V. Reynolds
Also filed as: REYNOLDS TRACY · REYNOLDS TRACY V
31 granted patents·2 pending applications·730 citations·filing 1997–2019
97Inventor score
Top patents by PatentIndex Score
33 records- 0197US6246108B1Integrated circuit package including lead frame with electrically isolated alignment featureMICRON TECHNOLOGY INC·Filed 1999·Granted Jun 12, 2001·273 cites·20 claims
- 0297US6048744AIntegrated circuit package alignment featureMICRON TECHNOLOGY INC·Filed 1997·Granted Apr 11, 2000·275 cites·6 claims
- 0387US8354301B2Packaged microdevices and methods for manufacturing packaged microdevicesMICRON TECHNOLOGY INC·Filed 2011·Granted Jan 15, 2013·7 cites·23 claims
- 0486US7868440B2Packaged microdevices and methods for manufacturing packaged microdevicesMICRON TECHNOLOGY INC·Filed 2006·Granted Jan 11, 2011·11 cites·13 claims
- 0582US10256214B2Computer modules with small thicknesses and associated methods of manufacturingMICRON TECHNOLOGY INC·Filed 2017·Granted Apr 9, 2019·2 cites·21 claims
- 0679US7851922B2Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devicesROUND ROCK RES LLC·Filed 2008·Granted Dec 14, 2010·5 cites·16 claims
- 0776US8644030B2Computer modules with small thicknesses and associated methods of manufacturingGIBBONS KEVIN·Filed 2009·Granted Feb 4, 2014·5 cites·12 claims
- 0876US7423336B2Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devicesMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 9, 2008·14 cites·34 claims
- 0976US6836003B2Integrated circuit package alignment featureMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 28, 2004·17 cites·8 claims
- 1075US6882034B2Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methodsMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 19, 2005·15 cites·87 claims
- 1174US6199743B1Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assembliesMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 13, 2001·37 cites·6 claims
- 1271US6987325B2Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting elementMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 17, 2006·10 cites·22 claims
- 1370US6991970B2Method and apparatus for circuit completion through the use of ball bonds or other connections during the formation of semiconductor deviceMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 31, 2006·14 cites·14 claims
- 1469US7282805B2Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting elementMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 16, 2007·2 cites·15 claims
- 1569US7282397B2Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devicesMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 16, 2007·2 cites·23 claims
- 1665US7944057B2Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devicesROUND ROCK RES LLC·Filed 2009·Granted May 17, 2011·1 cites·20 claims
- 1764US6995043B2Methods for fabricating routing elements for multichip modulesMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 7, 2006·8 cites·22 claims
- 1863US10522515B2Computer modules with small thicknesses and associated methods of manufacturingMICRON TECHNOLOGY INC·Filed 2019·Granted Dec 31, 2019·0 cites·15 claims
- 1962US7372131B2Routing element for use in semiconductor device assembliesMICRON TECHNOLOGY INC·Filed 2005·Granted May 13, 2008·1 cites·11 claims
- 2059US6357275B1Apparatus and method for providing mechanically pre-formed conductive leadsMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 19, 2002·5 cites·9 claims
- 2158US7094631B2Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devicesMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 22, 2006·4 cites·21 claims
- 2257US8959759B2Method for assembling computer modules small in thicknessMICRON TECHNOLOGY INC·Filed 2014·Granted Feb 24, 2015·0 cites·14 claims
- 2355US8987885B2Packaged microdevices and methods for manufacturing packaged microdevicesMICRON TECHNOLOGY INC·Filed 2013·Granted Mar 24, 2015·0 cites·9 claims
- 2455US6454153B2Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assembliesMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 24, 2002·5 cites·20 claims
- 2554US9717157B2Computer modules with small thicknesses and associated methods of manufacturingMICRON TECHNOLOGY INC·Filed 2015·Granted Jul 25, 2017·0 cites·19 claims
- 2653US6509205B2Apparatus and method for providing mechanically pre-formed conductive leadsMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 21, 2003·3 cites·20 claims
- 2749US7372138B2Routing element for use in multi-chip modules, multi-chip modules including the routing element and methodsMICRON TECHNOLOGY INC·Filed 2005·Granted May 13, 2008·0 cites·12 claims
- 2849US6858453B1Integrated circuit package alignment featureMICRON TECHNOLOGY INC·Filed 1999·Granted Feb 22, 2005·11 cites·12 claims
- 2948US2011147910A1Method for stacking die in thin, small-outline packageMICRON TECHNOLOGY INC·Filed 2009·Application pending·0 cites
- 3047US2006121650A1Method and apparatus for circuit completion through the use of ball bonds or other connections during the formation of a semiconductor deviceFOGAL RICH·Filed 2006·Application pending·0 cites
- 3144US6474532B2Apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assembliesMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 5, 2002·1 cites·25 claims
- 3239US6504257B1Apparatus and method for providing mechanically pre-formed conductive leadsMICRON TECHNOLOGY INC·Filed 2000·Granted Jan 7, 2003·0 cites·20 claims
- 3333US6221748B1Apparatus and method for providing mechanically pre-formed conductive leadsMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 24, 2001·2 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →