Inventor · disambiguated record
Trianggono S. Widodo
Also filed as: WIDODO TRIANGGONO · WIDODO TRIANGGONO S
0 granted patents·6 pending applications·0 citations·filing 2022–2024
Technology areasH10W
Files withINTEL CORP6
Top patents by PatentIndex Score
6 records- 0159US2024347590A1Methods and apparatus to reduce stress in integrated circuit packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 0259US2025309192A13d die stacking with hybrid bonding and through dielectric via structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 0358US2025279384A1Methods and apparatus using polymer material to fill gaps between semiconductor diesINTEL CORP·Filed 2024·Application pending·0 cites
- 0453US2024113073A1Side of a die that is coplanar with a side of a moldingINTEL CORP·Filed 2022·Application pending·0 cites
- 0552US2025309143A1Hermetic layer above a die and mold material within a packageINTEL CORP·Filed 2024·Application pending·0 cites
- 0652US2025006678A1Packaging architecture for wafer-scale known-good-die hybrid bondingINTEL CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →