Inventor · disambiguated record
Tsung-Wen Chang
Also filed as: CHANG TSUNG-WEN
2 granted patents·5 citations·filing 2012–2016
48Inventor score
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2 records- 0166US8956920B2Leadframe for integrated circuit die packaging in a molded package and a method for preparing such a leadframeWU TSUNG YI·Filed 2012·Granted Feb 17, 2015·4 cites·19 claims
- 0261US9778712B2Method of integrating a server using alternating current power into a server system using direct current power and alternative junction device thereforLITE-ON ELECTRONICS (GUANGZHOU) CO LTD·Filed 2016·Granted Oct 3, 2017·1 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →