Inventor · disambiguated record
Tso-Jung Chang
Also filed as: CHANG TSO-JUNG
1 granted patent·12 pending applications·1 citations·filing 2014–2025
17Inventor score
Top patents by PatentIndex Score
13 records- 0190US12417991B2Chip stack structure with conductive plug and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 16, 2025·1 cites·20 claims
- 0277US2025355171A1Integrated Memory Device with Optical LinkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0374US2025323198A1Chip stack structure with conductive plug and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0473US2025329701A1Semiconductor package structure with interposer diesTAIWAN SEMICONDUCTOR MANUFACTURIING CO LTD·Filed 2025·Application pending·0 cites
- 0571US2025239579A1Semiconductor package structure with interposer diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0671US2025244527A1Integrated Memory Device with Optical LinkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0757US2025239578A1Optical connector unit for a photonic assembly and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0854US2024404900A1Semiconductor package and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0953US2024047365A1Structure and formation method of package with integrated chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1053US2024079392A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1153US2024206193A1Structure and formation method of package with integrated chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1252US2025237810A1Tunable photonic couplers for electronic/photonic systems and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1332US2015305068A1Method and device for communication back end processing based on dynamic feedback of user end to configure communication linkingUNIV YUAN ZE·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →