Inventor · disambiguated record
Tsung-Chieh Chen
Also filed as: CHEN TSUNG-CHIEH
9 granted patents·2 pending applications·435 citations·filing 1998–2017
91Inventor score
Files withVANGUARD INT SEMICONDUCT CORP3FIRST INT COMPUTER INC2PICTA TECHNOLOGY INC2CHEN CHIN-CHUNG1FIRST INTERNATIONAL COMPUTER I1
Top patents by PatentIndex Score
11 records- 0193US6077724AMulti-chips semiconductor package and fabrication methodFIRST INTERNATIONAL COMPUTER I·Filed 1998·Granted Jun 20, 2000·126 cites·12 claims
- 0290US6215180B1Dual-sided heat dissipating structure for integrated circuit packageFIRST INT COMPUTER INC·Filed 1999·Granted Apr 10, 2001·141 cites·6 claims
- 0375US6130477AThin enhanced TAB BGA package having improved heat dissipationFiled 1999·Granted Oct 10, 2000·55 cites·20 claims
- 0468US6492196B1Packaging process for wafer level IC devicePICTA TECHNOLOGY INC·Filed 2002·Granted Dec 10, 2002·19 cites·8 claims
- 0567US6245598B1Method for wire bonding a chip to a substrate with recessed bond pads and devices formedVANGUARD INT SEMICONDUCT CORP·Filed 1999·Granted Jun 12, 2001·36 cites·8 claims
- 0664US6448110B1Method for fabricating a dual-chip package and package formedVANGUARD INT SEMICONDUCT CORP·Filed 1999·Granted Sep 10, 2002·31 cites·14 claims
- 0749US6075281AModified lead finger for wire bondingVANGUARD INT SEMICONDUCT CORP·Filed 1999·Granted Jun 13, 2000·16 cites·14 claims
- 0843US2009268471A1Lens device and illumination apparatus having the sameCHEN CHIN-CHUNG·Filed 2008·Application pending·0 cites
- 0942US6160311AEnhanced heat dissipating chip scale package method and devicesFIRST INT COMPUTER INC·Filed 1999·Granted Dec 12, 2000·11 cites·7 claims
- 1031US2003134451A1Structure and process for packaging back-to-back chipsPICTA TECHNOLOGY INC·Filed 2002·Application pending·0 cites
- 1128US10331789B2Semantic analysis apparatus, method, and non-transitory computer readable storage medium thereofINST INFORMATION IND·Filed 2017·Granted Jun 25, 2019·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →