Inventor · disambiguated record
Tsung-Te Chou
Also filed as: CHOU TSUNG-TE
5 granted patents·1 pending application·228 citations·filing 2013–2019
79Inventor score
Top patents by PatentIndex Score
6 records- 0198US9443796B2Air trench in packages incorporating hybrid bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 13, 2016·221 cites·20 claims
- 0289US9786628B2Air trench in packages incorporating hybrid bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 10, 2017·4 cites·20 claims
- 0381US10347548B2Integrated circuit package structure and testing method using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 9, 2019·3 cites·20 claims
- 0457US10699977B2Method of detecting delamination in an integrated circuit package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 30, 2020·0 cites·20 claims
- 0556US9502396B2Air trench in packages incorporating hybrid bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 22, 2016·0 cites·20 claims
- 0644US2018294392A1Composite conducive to heat dissipation of led-mounted substrate and method of manufacturing the sameNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →