Inventor · disambiguated record
Tsung-Yao Chu
Also filed as: CHU TSUNG YAO
8 granted patents·550 citations·filing 1997–2002
91Inventor score
Files withIND TECH RES INST8
Top patents by PatentIndex Score
8 records- 0194US6459150B1Electronic substrate having an aperture position through a substrate, conductive pads, and an insulating layerIND TECH RES INST·Filed 2000·Granted Oct 1, 2002·125 cites·9 claims
- 0293US6433427B1Wafer level package incorporating dual stress buffer layers for I/O redistribution and method for fabricationIND TECH RES INST·Filed 2001·Granted Aug 13, 2002·110 cites·20 claims
- 0392US6197613B1Wafer level packaging method and devices formedIND TECH RES INST·Filed 1999·Granted Mar 6, 2001·156 cites·18 claims
- 0484US6365498B1Integrated process for I/O redistribution and passive components fabrication and devices formedIND TECH RES INST·Filed 1999·Granted Apr 2, 2002·74 cites·13 claims
- 0574US6312974B1Simultaneous bumping/bonding process utilizing edge-type conductive pads and device fabricatedIND TECH RES INST·Filed 2000·Granted Nov 6, 2001·30 cites·11 claims
- 0671US6566752B2Bonding pad and method for manufacturing itIND TECH RES INST·Filed 2002·Granted May 20, 2003·16 cites·10 claims
- 0770US6426555B1Bonding pad and method for manufacturing itIND TECH RES INST·Filed 2000·Granted Jul 30, 2002·15 cites·9 claims
- 0859US5893731AMethod for fabricating low cost integrated resistor capacitor combinationsIND TECH RES INST·Filed 1997·Granted Apr 13, 1999·24 cites·28 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →