Inventor · disambiguated record
Tsei-Chung Fu
Also filed as: FU TSEI-CHUNG
11 granted patents·705 citations·filing 2013–2020
88Inventor score
Top patents by PatentIndex Score
11 records- 0197US9461018B1Fan-out PoP structure with inconsecutive polymer layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 4, 2016·671 cites·20 claims
- 0293US10083913B2Fan-out POP structure with inconsecutive polymer layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 25, 2018·10 cites·20 claims
- 0393US9633924B1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 25, 2017·7 cites·20 claims
- 0492US9847269B2Fan-out packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 19, 2017·14 cites·20 claims
- 0577US9941244B2Protective layer for contact pads in fan-out interconnect structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 10, 2018·3 cites·24 claims
- 0668US11515288B2Protective layer for contact pads in fan-out interconnect structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·20 claims
- 0764US10636748B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 28, 2020·0 cites·20 claims
- 0858US10224293B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Mar 5, 2019·0 cites·20 claims
- 0957US10748869B2Protective layer for contact pads in fan-out interconnect structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 18, 2020·0 cites·20 claims
- 1041US9741693B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 22, 2017·0 cites·20 claims
- 1139US9358660B2Grinding wheel design with elongated teeth arrangementTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 7, 2016·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →