Inventor · disambiguated record
Tsuyoshi Fukada
Also filed as: FUKADA TSUYOSHI
41 granted patents·1 pending application·3,696 citations·filing 1984–2009
99Inventor score
Top patents by PatentIndex Score
42 records- 0199US4721364ADazzle-free mirror with photocell in a non-dazzle-free portionNIPPON DENSO CO·Filed 1984·Granted Jan 26, 1988·367 cites·8 claims
- 0299US4671615AControl apparatus for a dazzle-free reflection mirror of a vehicleNIPPON DENSO CO·Filed 1985·Granted Jun 9, 1987·361 cites·12 claims
- 0399US4669825AControl apparatus with delay circuit for antiglare mirrorNIPPON DENSO CO·Filed 1984·Granted Jun 2, 1987·258 cites·16 claims
- 0499US4632509AGlare-shielding type reflectorNIPPON DENSO CO·Filed 1984·Granted Dec 30, 1986·260 cites·6 claims
- 0599US4623222ALiquid crystal type dazzle-free transmissive-reflective mirrorNIPPON DENSO CO·Filed 1984·Granted Nov 18, 1986·547 cites·20 claims
- 0698US4676601ADrive apparatus for a liquid crystal dazzle-free mirror arrangementNIPPON DENSO CO·Filed 1986·Granted Jun 30, 1987·285 cites·12 claims
- 0798US4669826AApparatus for detecting the direction of light for dazzle-free mirrorsNIPPON DENSO CO·Filed 1985·Granted Jun 2, 1987·202 cites·4 claims
- 0897US4669827ADetection of manipulation of position apparatus for dazzle-free mirrorNIPPON DENSO CO·Filed 1985·Granted Jun 2, 1987·141 cites·10 claims
- 0996US4655549AAutomatic antidazzle semitransparent mirrorNIPPON DENSO CO·Filed 1985·Granted Apr 7, 1987·144 cites·7 claims
- 1095US6429506B1Semiconductor device produced by dicingDENSO CORP·Filed 2000·Granted Aug 6, 2002·82 cites·1 claims
- 1195US6240782B1Semiconductor physical quantity sensor and production method thereofDENSO CORP·Filed 1999·Granted Jun 5, 2001·119 cites·16 claims
- 1294US6151966ASemiconductor dynamical quantity sensor device having electrodes in Rahmen structureDENSO CORP·Filed 1999·Granted Nov 28, 2000·111 cites·23 claims
- 1393US6287885B1Method for manufacturing semiconductor dynamic quantity sensorDENSO CORP·Filed 1999·Granted Sep 11, 2001·84 cites·38 claims
- 1491US6423563B2Method for manufacturing semiconductor dynamic quantity sensorDENSO CORP·Filed 2001·Granted Jul 23, 2002·77 cites·36 claims
- 1591US5289721ASemiconductor pressure sensorNIPPON DENSO CO·Filed 1991·Granted Mar 1, 1994·63 cites·16 claims
- 1686US6308567B1Angular velocity sensorDENSO CORP·Filed 1999·Granted Oct 30, 2001·109 cites·17 claims
- 1785US4687956ALiquid crystal element driving apparatusNIPPON DENSO CO·Filed 1984·Granted Aug 18, 1987·52 cites·12 claims
- 1883US8028584B2Pressure sensor and method for manufacturing the sameDENSO CORP·Filed 2008·Granted Oct 4, 2011·12 cites·42 claims
- 1979US7298022B2Semiconductor sensorDENSO CORP·Filed 2005·Granted Nov 20, 2007·3 cites·11 claims
- 2077US7214625B2Method for manufacturing movable portion of semiconductor deviceDENSO CORP·Filed 2004·Granted May 8, 2007·22 cites·56 claims
- 2177US6444543B2Semiconductor sensor device and method of manufacturing the sameDENSO CORP·Filed 2001·Granted Sep 3, 2002·23 cites·6 claims
- 2276US5408112ASemiconductor strain sensor having improved resistance to bonding strain effectsNIPPON DENSO CO·Filed 1993·Granted Apr 18, 1995·36 cites·28 claims
- 2374US5654244AProcess for producing semiconductor strain-sensitive sensorNIPPON DENSO CO·Filed 1995·Granted Aug 5, 1997·34 cites·20 claims
- 2473US5949118AEtching method for silicon substrates and semiconductor sensorNIPPON DENSO CO·Filed 1996·Granted Sep 7, 1999·30 cites·20 claims
- 2571US6284670B1Method of etching silicon wafer and silicon waferDENSO CORP·Filed 1998·Granted Sep 4, 2001·39 cites·49 claims
- 2669US6787866B2Semiconductor device having a moveable member therein and a protective member disposed thereonDENSO CORP·Filed 2002·Granted Sep 7, 2004·10 cites·19 claims
- 2769US5622901AMethod of forming a semiconductor strain sensorNIPPON DENSO CO·Filed 1994·Granted Apr 22, 1997·28 cites·24 claims
- 2868US5525549AMethod for producing an acceleration sensorNIPPON DENSO CO·Filed 1993·Granted Jun 11, 1996·42 cites·13 claims
- 2967US5736061ASemiconductor element mount and producing method thereforNIPPON DENSO CO·Filed 1996·Granted Apr 7, 1998·23 cites·28 claims
- 3065US6753201B2Method of manufacturing semiconductor device capable of sensing dynamic quantityDENSO CORP·Filed 2002·Granted Jun 22, 2004·11 cites·8 claims
- 3165US6077721AMethod of producing an anodic bonded semiconductor sensor elementNIPPON DENSO CO·Filed 1997·Granted Jun 20, 2000·22 cites·13 claims
- 3263US2005216361A1Business transaction processing systemFIDEC CORP·Filed 2004·Application pending·0 cites
- 3362US6718824B2Semiconductor dynamic quantity detecting sensor and manufacturing method of the sameNIPPON SOKEN·Filed 2001·Granted Apr 13, 2004·9 cites·13 claims
- 3459US5643803AProduction method of a semiconductor dynamic sensorNIPPON DENSO CO·Filed 1993·Granted Jul 1, 1997·30 cites·15 claims
- 3559US5549785AMethod of producing a semiconductor dynamic sensorNIPPON DENSO CO·Filed 1993·Granted Aug 27, 1996·20 cites·14 claims
- 3656US6906394B2Method of manufacturing semiconductor device capable of sensing dynamic quantityDENSO CORP·Filed 2003·Granted Jun 14, 2005·6 cites·6 claims
- 3748US6143584AMethod for fabrication of a semiconductor sensorDENSO CORP·Filed 1998·Granted Nov 7, 2000·12 cites·42 claims
- 3843US8006553B2Semiconductor sensor having heater on insulation film and manufacturing method of the sameDENSO CORP·Filed 2009·Granted Aug 30, 2011·1 cites·14 claims
- 3940US6194236B1Electrochemical etching method for silicon substrate having PN junctionDENSO CORP·Filed 1999·Granted Feb 27, 2001·5 cites·14 claims
- 4037US5575887APlasma etching method and device manufacturing method therebyNIPPON DENSO CO·Filed 1995·Granted Nov 19, 1996·6 cites·13 claims
- 4134US5920106ASemiconductor device and method for producing the sameDENSO CORP·Filed 1997·Granted Jul 6, 1999·4 cites·19 claims
- 4232US5677248AMethod of etching semiconductor wafersNIPPON DENSO CO·Filed 1995·Granted Oct 14, 1997·6 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →