Inventor · disambiguated record

Tsuyoshi Fukuo

Also filed as: FUKUO TSUYOSHI

1 granted patent·1 pending application·2 citations·filing 2006–2006

19Inventor score

Technology areasH10W

Files withFUKUO TSUYOSHI1 INTEL CORP1

Top patents by PatentIndex Score

2 records

0149US7554198B2Flexible joint methodology to attach a die on an organic substrateINTEL CORP·Filed 2006·Granted Jun 30, 2009·2 cites·19 claims
0224US2007231970A1Cured mold compound spacer for stacked-die packageFUKUO TSUYOSHI·Filed 2006·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →