Inventor · disambiguated record
Tsuneyuki Hayashi
Also filed as: HAYASHI TSUNEYUKI · TSUNAKI AKIO
15 granted patents·2 pending applications·124 citations·filing 1979–2024
91Inventor score
Top patents by PatentIndex Score
17 records- 0182US4361776ACoil assembly for flat brushless motorSONY CORP·Filed 1980·Granted Nov 30, 1982·43 cites·16 claims
- 0274US7898321B2Driver circuitTEXAS INSTRUMENTS INC·Filed 2009·Granted Mar 1, 2011·3 cites·17 claims
- 0374US4507637ACoil for electric motorSONY CORP·Filed 1984·Granted Mar 26, 1985·21 cites·4 claims
- 0473US11418182B2Switch circuitryTOSHIBA KK·Filed 2019·Granted Aug 16, 2022·2 cites·12 claims
- 0564US10431539B2Semiconductor integrated circuit including discharge control circuitTOSHIBA KK·Filed 2017·Granted Oct 1, 2019·1 cites·12 claims
- 0662US4235656AMethod of and apparatus for forming a coreless armature winding for an electric machineSONY CORP·Filed 1979·Granted Nov 25, 1980·20 cites·23 claims
- 0755US11632104B2Semiconductor deviceTOSHIBA KK·Filed 2022·Granted Apr 18, 2023·0 cites·26 claims
- 0853US2025314693A1Semiconductor integrated circuitTOSHIBA KK·Filed 2024·Application pending·0 cites
- 0949US12063031B2Semiconductor deviceTOSHIBA KK·Filed 2021·Granted Aug 13, 2024·0 cites·11 claims
- 1049US11843370B2Switching deviceTOSHIBA KK·Filed 2022·Granted Dec 12, 2023·0 cites·9 claims
- 1148US10969426B2Semiconductor integrated circuitTOSHIBA KK·Filed 2019·Granted Apr 6, 2021·0 cites·15 claims
- 1246US5650177AResin molding apparatusSONY CORP·Filed 1995·Granted Jul 22, 1997·10 cites·6 claims
- 1344US5197391AMagnetically floating carrier system with carriage below rail support structure and load above support structure with balances between carriage and loadSONY CORP·Filed 1991·Granted Mar 30, 1993·13 cites·20 claims
- 1444US4601433AToroidal core winding apparatusSONY CORP·Filed 1984·Granted Jul 22, 1986·7 cites·6 claims
- 1541US2016042988A1Semiconductor process carrierNAT INST OF ADVANCED IND SCIEN·Filed 2013·Application pending·0 cites
- 1635US11342909B2Semiconductor integrated circuit and control method of semiconductor integrated circuitTOSHIBA KK·Filed 2020·Granted May 24, 2022·0 cites·11 claims
- 1735US5882692AResin molding apparatusSONY CORP·Filed 1997·Granted Mar 16, 1999·4 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →