Inventor · disambiguated record
Tsuyoshi Honda
Also filed as: HONDA TSUYOSHI
14 granted patents·5 pending applications·141 citations·filing 1999–2009
91Inventor score
Files withSHINETSU CHEMICAL CO13HONDA TSUYOSHI2KANAMARU TATSUYA1PANASONIC CORP1Panasonic Corporaiton1
Top patents by PatentIndex Score
19 records- 0186US6512031B1Epoxy resin composition, laminate film using the same, and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2000·Granted Jan 28, 2003·47 cites·8 claims
- 0268US6680007B2Conductive resin compositions and electronic parts using the sameSHINETSU CHEMICAL CO·Filed 2002·Granted Jan 20, 2004·13 cites·10 claims
- 0367US6645632B2Film-type adhesive for electronic components, and electronic components bonded therewithSHINETSU CHEMICAL CO·Filed 2001·Granted Nov 11, 2003·15 cites·9 claims
- 0467US6383659B1Epoxy resin composition, laminate film using the same, and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2000·Granted May 7, 2002·14 cites·9 claims
- 0565US8522815B2Gas shutoff deviceHONDA TSUYOSHI·Filed 2009·Granted Sep 3, 2013·6 cites·9 claims
- 0661US6210811B1Epoxy resin composition, laminate film using the same, and semiconductor deviceSHINETSU CHEMICAL CO·Filed 1999·Granted Apr 3, 2001·25 cites·8 claims
- 0759US6709753B2Silicone-modified epoxy or phenolic resin compositions and semiconductor devices sealed therewithSHINETSU CHEMICAL CO·Filed 2002·Granted Mar 23, 2004·9 cites·15 claims
- 0857US8110066B2Adhesive composition suitable to be applied by screen printingKANAMARU TATSUYA·Filed 2008·Granted Feb 7, 2012·2 cites·12 claims
- 0953US6627328B2Light-transmissive epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2001·Granted Sep 30, 2003·5 cites·15 claims
- 1052US7855245B2Adhesive composition and a method of using the sameSHINETSU CHEMICAL CO·Filed 2008·Granted Dec 21, 2010·1 cites·9 claims
- 1151US6794058B2Flip-chip type semiconductor deviceSHINETSU CHEMICAL CO·Filed 2003·Granted Sep 21, 2004·4 cites·2 claims
- 1247US2011077874A1Appliance monitoring apparatusPANASONIC CORP·Filed 2009·Application pending·0 cites
- 1343US2011066387A1Appliance monitoring apparatusPanasonic Corporaiton·Filed 2009·Application pending·0 cites
- 1442US2009133833A1Epoxy Resin Composition and Die Bonding Material Comprising the CompositionSHINETSU CHEMICAL CO·Filed 2006·Application pending·0 cites
- 1542US2002058742A1Light-transmissive epoxy resin composition and flip-chip type semiconductor deviceFiled 2001·Application pending·0 cites
- 1641US8496023B2Temporary drainage system and temporary drainage methodHONDA TSUYOSHI·Filed 2009·Granted Jul 30, 2013·0 cites·6 claims
- 1739US7901992B2Die bonding agent and a semiconductor device made by using the sameSHINETSU CHEMICAL CO·Filed 2008·Granted Mar 8, 2011·0 cites·10 claims
- 1839US2005152773A1Liquid epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2004·Application pending·0 cites
- 1937US7169474B2Epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2004·Granted Jan 30, 2007·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →