Inventor · disambiguated record
Tsung-Yang Hsieh
Also filed as: HSIEH TSUNG-YANG
8 granted patents·4 pending applications·8 citations·filing 2018–2025
78Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD12
Top patents by PatentIndex Score
12 records- 0187US11315860B2Semiconductor package and manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 26, 2022·5 cites·20 claims
- 0277US11183399B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 23, 2021·2 cites·20 claims
- 0376US2025309120A1Bridge die having different surface orientation than ic dies interconnected by the bridge dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0473US2024395639A1Semiconductor package including test line structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0572US12463099B2Semiconductor package including test line structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 4, 2025·0 cites·20 claims
- 0672US12424558B2Bridge die having different surface orientation than IC dies interconnected by the bridge dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 23, 2025·0 cites·20 claims
- 0770US12261133B2Interposer with warpage-relief trenchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Mar 25, 2025·0 cites·20 claims
- 0869US11101140B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·1 cites·20 claims
- 0968US11742276B2Semiconductor package and manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 29, 2023·0 cites·20 claims
- 1058US11973040B2Interposer with warpage-relief trenchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 30, 2024·0 cites·20 claims
- 1155US2025006564A1Semiconductor structures with cover layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1255US2025006553A1Semiconductor structures with improved metal capping layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →