Inventor · disambiguated record
Tsun-Lung Hsieh
Also filed as: HSIEH TSUN-LUNG
3 granted patents·2 pending applications·6 citations·filing 2016–2024
59Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0182US10522508B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Dec 31, 2019·4 cites·20 claims
- 0270US10236240B2Low loss substrate for high data rate applicationsADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Mar 19, 2019·2 cites·20 claims
- 0354US2025062265A1Semiconductor package and manufacturing method thereofORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2024·Application pending·0 cites
- 0453US2025062281A1Semiconductor package and manufacturing method thereofORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2024·Application pending·0 cites
- 0551US10903152B2Low loss substrate for high data rate applicationsADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jan 26, 2021·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →