Inventor · disambiguated record
Tsung-Lin Hsieh
Also filed as: HSIEH TSUNG-LIN
4 granted patents·5 pending applications·7 citations·filing 2008–2024
62Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD4CHI MEI COMM SYSTEMS INC3HON HAI PREC IND CO LTD1LIU HSIN-HUNG1
Top patents by PatentIndex Score
9 records- 0181US12358783B2Wire-bond damper for shock absorptionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
- 0271US11987494B2Wire-bond damper for shock absorptionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 21, 2024·0 cites·20 claims
- 0367US8013796B2Dual-band antennaCHI MEI COMM SYSTEMS INC·Filed 2008·Granted Sep 6, 2011·7 cites·13 claims
- 0459US2025383503A1Photonic integrated circuit and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0556US2025271614A1Waveguide with transitional portion and method of fabricating sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0640US2010289702A1Dual-band antenna and portable wireless communication device using the sameCHI MEI COMM SYSTEMS INC·Filed 2009·Application pending·0 cites
- 0738US8270182B2Mobile phone with metal hinged shieldLIU HSIN-HUNG·Filed 2010·Granted Sep 18, 2012·0 cites·4 claims
- 0836US2013300631A1Antenna with feeder and electronic deviceHON HAI PREC IND CO LTD·Filed 2013·Application pending·0 cites
- 0933US2011181480A1Antenna moduleCHI MEI COMM SYSTEMS INC·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →