Inventor · disambiguated record
Tsukasa Ishigaki
Also filed as: ISHIGAKI TSUKASA
5 granted patents·5 pending applications·156 citations·filing 2003–2019
79Inventor score
Top patents by PatentIndex Score
10 records- 0196US7189778B2Thermally conductive polymer molded article and method for producing the samePOLYMATECH CO LTD·Filed 2003·Granted Mar 13, 2007·106 cites·15 claims
- 0292US7079405B2Thermal conductive polymer molded article and method for producing the samePOLYMATECH CO LTD·Filed 2003·Granted Jul 18, 2006·47 cites·13 claims
- 0369US9188742B2Teraherz-wave connector and teraherz-wave integrated circuits, and wave guide and antenna structureROHM CO LTD·Filed 2014·Granted Nov 17, 2015·2 cites·27 claims
- 0458US2008295959A1Thermally Conductive Adhesive Composition and Adhesion MethodPOLYMATECH CO LTD·Filed 2008·Application pending·0 cites
- 0552US7347955B2Heat conducting polymer mold productsPOLYMATECH CO LTD·Filed 2003·Granted Mar 25, 2008·1 cites·12 claims
- 0646US12384950B2Heat-dissipating composition, heat-dissipating member, and filler aggregate for heat-dissipating memberSEKISUI CHEMICAL CO LTD·Filed 2019·Granted Aug 12, 2025·0 cites·18 claims
- 0746US2007116938A1Polymer composite formed article, printed wiring board using the formed article, and methods of producing themTOBITA MASAYUKI·Filed 2005·Application pending·0 cites
- 0845US2008004191A1Thermal conductive greasePOLYMATECH CO LTD·Filed 2006·Application pending·0 cites
- 0937US2004224163A1Thermally-conductive epoxy resin molded article and method of producing the samePOLYMATECH CO LTD·Filed 2004·Application pending·0 cites
- 1036US2004102597A1Thermally-conductive epoxy resin molded article and method of manufacturing the sameFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →