Inventor · disambiguated record
Tsuyoshi Kanki
Also filed as: KANKI TSUYOSHI
10 granted patents·5 pending applications·6 citations·filing 2006–2017
79Inventor score
Top patents by PatentIndex Score
15 records- 0175US10595412B2Semiconductor device, electronic device, method of manufacturing semiconductor device, and method of manufacturing electronic deviceFUJITSU LTD·Filed 2017·Granted Mar 17, 2020·2 cites·3 claims
- 0267US9263326B2Interconnection structure and method of forming the sameFUJITSU LTD·Filed 2015·Granted Feb 16, 2016·1 cites·9 claims
- 0367US8399295B2Semiconductor device and its manufacture methodKISHII SADAHIRO·Filed 2011·Granted Mar 19, 2013·3 cites·9 claims
- 0451US8791561B2Semiconductor device and its manufacture methodFUJITSU LTD·Filed 2013·Granted Jul 29, 2014·0 cites·6 claims
- 0547US7842614B2Method for manufacturing semiconductor device and polisher used in the method for manufacturing semiconductor deviceFUJITSU LTD·Filed 2008·Granted Nov 30, 2010·0 cites·17 claims
- 0646US2017110369A1Electronic device and method for producing sameFUJITSU LTD·Filed 2016·Application pending·0 cites
- 0745US2009236232A1Electrolytic plating solution, electrolytic plating method, and method for manufacturing semiconductor deviceFUJITSU LTD·Filed 2009·Application pending·0 cites
- 0844US2012181070A1Interconnection structure and method of forming the sameKANKI TSUYOSHI·Filed 2012·Application pending·0 cites
- 0943US9196526B2Semiconductor device and manufacturing method having copper interconnects with metal film, barrier metal, and metal capsFUJITSU LTD·Filed 2013·Granted Nov 24, 2015·0 cites·9 claims
- 1043US2013093092A1Electronic device and method for producing sameKANKI TSUYOSHI·Filed 2012·Application pending·0 cites
- 1141US8872040B2Wiring structure and manufacturing method thereof, and electronic apparatus and manufacturing method thereofKANKI TSUYOSHI·Filed 2012·Granted Oct 28, 2014·0 cites·17 claims
- 1238US8691699B2Manufacturing method of semiconductor device and semiconductor deviceKANKI TSUYOSHI·Filed 2012·Granted Apr 8, 2014·0 cites·12 claims
- 1338US8101513B2Manufacture method for semiconductor device using damascene methodKANKI TSUYOSHI·Filed 2006·Granted Jan 24, 2012·0 cites·9 claims
- 1437US10283446B2Wiring board including multiple wiring layersFUJITSU LTD·Filed 2017·Granted May 7, 2019·0 cites·7 claims
- 1534US2016381795A1Electronic device and method for manufacturing the sameFUJITSU LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →