Inventor · disambiguated record
Tsutomu Kiyosawa
Also filed as: KIYOSAWA TSUTOMU
20 granted patents·7 pending applications·45 citations·filing 2012–2025
92Inventor score
Top patents by PatentIndex Score
27 records- 0185US9362366B2Semiconductor element, semiconductor element manufacturing method, semiconductor module, semiconductor module manufacturing method, and semiconductor packagePANASONIC IP MAN CO LTD·Filed 2014·Granted Jun 7, 2016·8 cites·5 claims
- 0284US9985125B1Silicon carbide semiconductor devicePANASONIC IP MAN CO LTD·Filed 2017·Granted May 29, 2018·6 cites·12 claims
- 0380US10361297B2Semiconductor epitaxial wafer, semiconductor device, and method of producing semiconductor devicePANASONIC IP MAN CO LTD·Filed 2018·Granted Jul 23, 2019·2 cites·15 claims
- 0478US9130036B2Semiconductor device and method for manufacturing samePANASONIC IP MAN CO LTD·Filed 2013·Granted Sep 8, 2015·4 cites·17 claims
- 0578US8933466B2Semiconductor elementPANASONIC CORP·Filed 2012·Granted Jan 13, 2015·5 cites·27 claims
- 0677US9362370B2Silicon carbide semiconductor device having nitrogen-containing silicon alloy for ohmic contact to P-type impurity regionPANASONIC CORP·Filed 2013·Granted Jun 7, 2016·4 cites·11 claims
- 0777US9209294B1Semiconductor device and method for manufacturing samePANASONIC CORP·Filed 2013·Granted Dec 8, 2015·4 cites·20 claims
- 0877US9018699B2Silicon carbide semiconductor element and method for fabricating the sameKIYOSAWA TSUTOMU·Filed 2012·Granted Apr 28, 2015·6 cites·13 claims
- 0974US9087894B2Semiconductor device and method of manufacturing the deviceKUDOU CHIAKI·Filed 2012·Granted Jul 21, 2015·3 cites·20 claims
- 1073US10573740B2Method of producing semiconductor devicePANASONIC IP MAN CO LTD·Filed 2019·Granted Feb 25, 2020·1 cites·2 claims
- 1169US10043877B2Metal-insulator-semiconductor field effect transistor (MISFET) device and method for manufacturing the samePANASONIC IP MAN CO LTD·Filed 2017·Granted Aug 7, 2018·1 cites·8 claims
- 1269US2025389047A1Vapor phase growth apparatusTOSHIBA KK·Filed 2025·Application pending·0 cites
- 1360US10573739B2Method of producing semiconductor device for reducing variations of device characteristics within a surface of a semiconductor waferPANASONIC IP MAN CO LTD·Filed 2018·Granted Feb 25, 2020·0 cites·6 claims
- 1460US8847238B2Semiconductor device which can withstand high voltage or high current and method for fabricating the samePANASONIC CORP·Filed 2013·Granted Sep 30, 2014·1 cites·15 claims
- 1558US2025253263A1Manufacturing method of semiconductor device and semiconductor substrateTOSHIBA KK·Filed 2025·Application pending·0 cites
- 1658US2024321955A1Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2023·Application pending·0 cites
- 1756US10355091B2Semiconductor device and method for manufacturing the samePANASONIC IP MAN CO LTD·Filed 2018·Granted Jul 16, 2019·0 cites·3 claims
- 1856US10262909B2Semiconductor device and method for manufacturing the samePANASONIC IP MAN CO LTD·Filed 2018·Granted Apr 16, 2019·0 cites·5 claims
- 1956US2024332415A1Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2023·Application pending·0 cites
- 2055US2025212444A1Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2025·Application pending·0 cites
- 2154US10211293B2Semiconductor device and method for manufacturing the samePANASONIC IP MAN CO LTD·Filed 2018·Granted Feb 19, 2019·0 cites·5 claims
- 2254US2025236989A1Silicon carbide epitaxial wafer and method for manufacturing sameTOSHIBA KK·Filed 2025·Application pending·0 cites
- 2353US11171214B2Semiconductor epitaxial wafer, semiconductor device, and method for manufacturing semiconductor epitaxial waferPANASONIC IP MAN CO LTD·Filed 2020·Granted Nov 9, 2021·0 cites·13 claims
- 2453US10600880B2Semiconductor device and method for manufacturing the samePANASONIC IP MAN CO LTD·Filed 2018·Granted Mar 24, 2020·0 cites·6 claims
- 2553US10141235B2Semiconductor device and method for manufacturing the samePANASONIC IP MAN CO LTD·Filed 2018·Granted Nov 27, 2018·0 cites·2 claims
- 2649US2025270702A1WAFER SUPPORT DEVICE AND SiC EPITAXIAL GROWTH APPARATUSTOSHIBA KK·Filed 2025·Application pending·0 cites
- 2743US10763330B2Silicon carbide semiconductor element and method for manufacturing samePANASONIC IP MAN CO LTD·Filed 2019·Granted Sep 1, 2020·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →