Inventor · disambiguated record
Tsu-Wei Ku
Also filed as: KU TSU-WEI
4 granted patents·133 citations·filing 1993–2004
80Inventor score
Technology areasG06F
Top patents by PatentIndex Score
4 records- 0172US6792585B1Method and apparatus of relative datapath cell placement with structure bondingARCADIA DESIGN SYSTEMS INC·Filed 2000·Granted Sep 14, 2004·25 cites·8 claims
- 0262US7200827B1Chip-area reduction and congestion alleviation by timing-and-routability-driven empty-space propagationAPEX DESIGN SYSTEMS INC·Filed 2004·Granted Apr 3, 2007·19 cites·10 claims
- 0358US5384720ALogic circuit simulator and logic simulation method having reduced number of simulation eventsHITACHI MICRO SYSTEMS INC·Filed 1993·Granted Jan 24, 1995·45 cites·12 claims
- 0456US5930499AMethod for mixed placement of structured and non-structured circuit elementsARCADIA DESIGN SYSTEMS INC·Filed 1996·Granted Jul 27, 1999·44 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →