Inventor · disambiguated record
Tsukasa Ohnishi
Also filed as: OHNISHI TSUKASA
18 granted patents·5 pending applications·103 citations·filing 2002–2018
93Inventor score
Files withSENJU METAL INDUSTRY CO9OHNISHI TSUKASA4SHIMAMURA MASATO2YOSHIKAWA SHUNSAKU2ISHIBASHI SEIKO1
Top patents by PatentIndex Score
23 records- 0190US7682468B2Lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2007·Granted Mar 23, 2010·15 cites·9 claims
- 0284US7282175B2Lead-free solderSENJU METAL INDUSTRY CO·Filed 2004·Granted Oct 16, 2007·32 cites·13 claims
- 0381US7338567B2Lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2003·Granted Mar 4, 2008·19 cites·15 claims
- 0476US9527167B2Lead-free solder ballOHNISHI TSUKASA·Filed 2012·Granted Dec 27, 2016·4 cites·13 claims
- 0575US9700963B2Lead-free solder ballSENJU METAL INDUSTRY CO·Filed 2016·Granted Jul 11, 2017·2 cites·14 claims
- 0667US7172726B2Lead-free solderSENJU METAL INDUSTRY CO·Filed 2003·Granted Feb 6, 2007·5 cites·11 claims
- 0765US8216395B2Lead-free solder alloyMUNEKATA OSAMU·Filed 2010·Granted Jul 10, 2012·3 cites·9 claims
- 0864US8220692B2Lead-free solderOHNISHI TSUKASA·Filed 2009·Granted Jul 17, 2012·2 cites·5 claims
- 0963US8691143B2Lead-free solder alloyOHNISHI TSUKASA·Filed 2006·Granted Apr 8, 2014·3 cites·4 claims
- 1061US7029542B2Lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2003·Granted Apr 18, 2006·8 cites·12 claims
- 1159US7282174B2Lead-free solder and soldered articleMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Oct 16, 2007·7 cites·14 claims
- 1256US9844837B2Lead-free solder alloySHIMAMURA MASATO·Filed 2012·Granted Dec 19, 2017·1 cites·5 claims
- 1356US8975757B2Lead-free solder connection structure and solder ballUESHIMA MINORU·Filed 2009·Granted Mar 10, 2015·1 cites·20 claims
- 1454US8896119B2Bonding material for semiconductor devicesSAKAMOTO YOSHITSUGU·Filed 2011·Granted Nov 25, 2014·1 cites·11 claims
- 1550US10076808B2Lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2013·Granted Sep 18, 2018·0 cites·7 claims
- 1650US2019076966A1Lead-Free Solder AlloySENJU METAL INDUSTRY CO·Filed 2018·Application pending·0 cites
- 1746US10137536B2Sn-Cu-based lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2012·Granted Nov 27, 2018·0 cites·7 claims
- 1845US9773721B2Lead-free solder alloy, connecting member and a method for its manufacture, and electronic partYOSHIKAWA SHUNSAKU·Filed 2014·Granted Sep 26, 2017·0 cites·15 claims
- 1942US8932519B2Solder alloyISHIBASHI SEIKO·Filed 2012·Granted Jan 13, 2015·0 cites·6 claims
- 2041US2003021718A1Lead-free solder alloyFiled 2002·Application pending·0 cites
- 2137US2009301760A1Method of Soldering a Module BoardSHIMAMURA MASATO·Filed 2006·Application pending·0 cites
- 2236US2012199393A1Lead-free solder alloy, connecting member and a method for its manufacture, and electronic partYOSHIKAWA SHUNSAKU·Filed 2010·Application pending·0 cites
- 2335US2007243098A1Lead-Free SolderOHNISHI TSUKASA·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →