Inventor · disambiguated record
Tsutomu Ota
Also filed as: OTA TSUTOMU
12 granted patents·1 pending application·837 citations·filing 1992–2007
94Inventor score
Top patents by PatentIndex Score
13 records- 0198US6031201ALaser machining apparatus with rotatable phase gratingSEIKO EPSON CORP·Filed 1997·Granted Feb 29, 2000·189 cites·5 claims
- 0296US6635850B2Laser machining method for precision machiningSEIKO EPSON CORP·Filed 2002·Granted Oct 21, 2003·76 cites·14 claims
- 0394US6809020B2Method for forming bump, semiconductor device and method for making the same, circuit board, and electronic deviceSEIKO EPSON CORP·Filed 2001·Granted Oct 26, 2004·108 cites·27 claims
- 0494US6577072B2Power supply and LED lamp deviceTAKION CO LTD·Filed 2000·Granted Jun 10, 2003·317 cites·25 claims
- 0589US7579692B2Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2007·Granted Aug 25, 2009·15 cites·8 claims
- 0684US6376799B1Laser machining apparatus with a rotatable phase gratingSEIKO EPSON CORP·Filed 1999·Granted Apr 23, 2002·38 cites·6 claims
- 0775US5504735AInformation recording disk having a stepped central recess and hub configurationSEIKO EPSON CORP·Filed 1993·Granted Apr 2, 1996·25 cites·26 claims
- 0869US7355280B2Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2004·Granted Apr 8, 2008·11 cites·4 claims
- 0964US5265086AInformation recording diskSEIKO EPSON CORP·Filed 1992·Granted Nov 23, 1993·16 cites·36 claims
- 1063US7413333B2Lighting apparatus and liquid crystal display apparatusTOSHIBA MATSUSHITA DISPLAY TEC·Filed 2005·Granted Aug 19, 2008·3 cites·9 claims
- 1163US6402527B2Structure for connecting terminals on wiring boardTOSHIBA KK·Filed 2001·Granted Jun 11, 2002·10 cites·12 claims
- 1263US6049318ADisplay control device and display control methodTOSHIBA KK·Filed 1996·Granted Apr 11, 2000·29 cites·8 claims
- 1336US2002033531A1Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrumentFiled 2001·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Tsutomu Ota files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →