Inventor · disambiguated record
Tsuyoshi Shintate
Also filed as: SHINTATE TSUYOSHI
15 granted patents·7 pending applications·26 citations·filing 2005–2010
88Inventor score
Top patents by PatentIndex Score
22 records- 0184US7416759B2Wiring pattern formation method, wiring pattern, and electronic deviceSEIKO EPSON CORP·Filed 2005·Granted Aug 26, 2008·13 cites·9 claims
- 0272US7250377B2Multi-layered structure forming method, method of manufacturing wiring substrate, and method of manufacturing electronic apparatusSEIKO EPSON CORP·Filed 2005·Granted Jul 31, 2007·4 cites·7 claims
- 0363US7538031B2Method of manufacturing a wiring substrate and an electronic instrumentSEIKO EPSON CORP·Filed 2005·Granted May 26, 2009·2 cites·16 claims
- 0462US7767252B2Multilayer structure forming method, method of manufacturing wiring board, and method manufacturing of electronic apparatusSEIKO EPSON CORP·Filed 2005·Granted Aug 3, 2010·2 cites·12 claims
- 0561US7793411B2Method for manufacturing electronic substrateSEIKO EPSON CORP·Filed 2007·Granted Sep 14, 2010·2 cites·8 claims
- 0661US7462241B2Pattern forming system, pattern forming method, and electronic apparatusSEIKO EPSON CORP·Filed 2005·Granted Dec 9, 2008·1 cites·5 claims
- 0761US7316974B2Wiring pattern formation method, manufacturing method for multi layer wiring substrate, and electronic deviceSEIKO EPSON CORP·Filed 2005·Granted Jan 8, 2008·2 cites·6 claims
- 0855US7871666B2Pattern forming system, pattern forming method, and electronic apparatusSEIKO EPSON CORP·Filed 2008·Granted Jan 18, 2011·0 cites·3 claims
- 0953US7723243B2Multi-layered structure forming method, method of manufacturing wiring substrate, and method of manufacturing electronic apparatusSEIKO EPSON CORP·Filed 2007·Granted May 25, 2010·0 cites·4 claims
- 1052US2009162536A1Method for forming film pattern, method for forming contact hole, method for forming bump, and method for manufacturing light emitting deviceSEIKO EPSON CORP·Filed 2008·Application pending·0 cites
- 1151US2011097515A1Pattern forming system, pattern forming method, and electronic apparatusSEIKO EPSON CORP·Filed 2010·Application pending·0 cites
- 1250US2009071706A1Method for producing multilayered wiring substrate, multilayered wiring substrate, and electronic apparatusSEIKO EPSON CORP·Filed 2008·Application pending·0 cites
- 1346US7629019B2Method for forming wiring pattern, wiring pattern, and electronic apparatusSEIKO EPSON CORP·Filed 2005·Granted Dec 8, 2009·0 cites·4 claims
- 1446US7541063B2Method for forming layerSEIKO EPSON CORP·Filed 2006·Granted Jun 2, 2009·0 cites·7 claims
- 1545US2006292769A1Multilayered structure forming methodSEIKO EPSON CORP·Filed 2006·Application pending·0 cites
- 1644US7972651B2Method for forming multi-layered structure, method for manufacturing wiring substrate, and method for manufacturing electronic apparatusSEIKO EPSON CORP·Filed 2005·Granted Jul 5, 2011·0 cites·8 claims
- 1744US7805836B2Manufacturing method of electronic board and multilayer wiring boardSEIKO EPSON CORP·Filed 2007·Granted Oct 5, 2010·0 cites·7 claims
- 1843US2008172868A1Method for manufacturing wiring board and method for manufacturing multilayer wiring boardSEIKO EPSON CORP·Filed 2007·Application pending·0 cites
- 1943US2005200684A1Pattern formation method, pattern formation system, and electronic deviceSEIKO EPSON CORP·Filed 2005·Application pending·0 cites
- 2042US2005208433A1Pattern forming method, circuit substrate and electronic apparatusSEIKO EPSON CORP·Filed 2005·Application pending·0 cites
- 2140US8322033B2Method for forming a conductive post for a multilayered wiring substrateHIRAI TOSHIMITSU·Filed 2008·Granted Dec 4, 2012·0 cites·14 claims
- 2236US8888229B2Method for forming a layer, method for manufacturing an active matrix substrate, and method for manufacturing a multilayered wiring substrateSHINTATE TSUYOSHI·Filed 2006·Granted Nov 18, 2014·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →