Inventor · disambiguated record
Tsubasa Shiratori
Also filed as: SHIRATORI TSUBASA
13 granted patents·3 pending applications·11 citations·filing 2010–2025
85Inventor score
Top patents by PatentIndex Score
16 records- 0188US10134582B2Tantalum compound and methods of forming thin film and fabricating integrated circuit device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 20, 2018·3 cites·10 claims
- 0278US10913754B2Lanthanum compound and methods of forming thin film and integrated circuit device using the lanthanum compoundSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 9, 2021·2 cites·15 claims
- 0375US9437419B2Method of forming a layer using a trialkylsilane silicon precursor compoundKIM YOUNSOO·Filed 2014·Granted Sep 6, 2016·4 cites·20 claims
- 0474US9896468B2Metal alkoxide compound, thin-film-forming material, method for producing thin film, and alcohol compoundADEKA CORP·Filed 2013·Granted Feb 20, 2018·1 cites·7 claims
- 0568US10155784B2Alcohol compoundADEKA CORP·Filed 2018·Granted Dec 18, 2018·0 cites·1 claims
- 0668US2025191851A1Electrode material, cathode foil for electrolytic capacitor, and electrolytic capacitorJAPAN CAPACITOR IND CO LTD·Filed 2025·Application pending·0 cites
- 0767US10651031B2Tantalum compoundSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 12, 2020·0 cites·20 claims
- 0865US9663538B2Aluminum compound, thin-film forming raw material, and method for producing thin filmADEKA CORP·Filed 2013·Granted May 30, 2017·1 cites·18 claims
- 0960US10927460B2Raw material for forming thin film, and method for manufacturing thin filmADEKA CORP·Filed 2017·Granted Feb 23, 2021·0 cites·4 claims
- 1058US11967502B2Methods of forming material layer, semiconductor devices, and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 23, 2024·0 cites·20 claims
- 1154US10900119B2Tungsten precursor and method of forming Tungsten containing layer using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 26, 2021·0 cites·20 claims
- 1253US10364495B2Method for producing a thin filmADEKA CORP·Filed 2017·Granted Jul 30, 2019·0 cites·4 claims
- 1351US2023220213A1Compositions for manufacturing thin film and methods for manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1447US11807652B2Tungsten compound, raw material for thin film formation and method for producing thin filmADEKA CORP·Filed 2018·Granted Nov 7, 2023·0 cites·2 claims
- 1543US9960032B2Methods of forming thin films and methods of fabricating integrated circuit devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 1, 2018·0 cites·19 claims
- 1629US2011268887A1Process for removing residual water molecules in metallic-thin-film production method and purge solventADEKA CORP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →