Inventor · disambiguated record
Tsukasa Takaiwa
Also filed as: TAKAIWA TSUKASA
2 granted patents·1 citations·filing 2019–2022
38Inventor score
Technology areasH10W
Files withAMKOR TECH JAPAN INC2
Top patents by PatentIndex Score
2 records- 0163US11967565B2Semiconductor devices including conductive structure and shielding layer and methods of manufacturing semiconductor devicesAMKOR TECH JAPAN INC·Filed 2022·Granted Apr 23, 2024·0 cites·16 claims
- 0262US11362041B2Semiconductor devices including shielding layer and methods of manufacturing semiconductor devicesAMKOR TECH JAPAN INC·Filed 2019·Granted Jun 14, 2022·1 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →