Inventor · disambiguated record
Tsuyoshi Tamogami
Also filed as: TAMOGAMI TSUYOSHI
4 granted patents·6 pending applications·0 citations·filing 2011–2019
53Inventor score
Top patents by PatentIndex Score
10 records- 0167US10611049B2Aqueous bonding compositionHENKEL AG & CO KGAA·Filed 2018·Granted Apr 7, 2020·0 cites·4 claims
- 0265US11485883B2Aqueous bonding compositionHENKEL AG & CO KGAA·Filed 2019·Granted Nov 1, 2022·0 cites·4 claims
- 0358US11236257B2Moisture-curable hot melt adhesiveHENKEL AG & CO KGAA·Filed 2018·Granted Feb 1, 2022·0 cites·13 claims
- 0451US2014024781A1Moisture-curable hot melt adhesiveHENKEL CORP·Filed 2013·Application pending·0 cites
- 0547US2018305588A1Aqueous bonding compositionHENKEL AG & CO KGAA·Filed 2018·Application pending·0 cites
- 0644US2013345354A1Moisture-curable hot melt adhesiveHENKEL AG & CO KGAA·Filed 2013·Application pending·0 cites
- 0739US2015376480A1Moisture-curable hot-melt adhesive agentHENKEL AG & CO KGAA·Filed 2015·Application pending·0 cites
- 0839US2012283370A1Moisture-curable hot melt adhesiveTAMOGAMI TSUYOSHI·Filed 2012·Application pending·0 cites
- 0937US2014272425A1Moisture-curable hot melt adhesiveHENKEL AG & CO KGA·Filed 2014·Application pending·0 cites
- 1035US8324299B2Moisture-curable hot melt adhesiveYAMAKOSHI HIDEYUKI·Filed 2011·Granted Dec 4, 2012·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →