Inventor · disambiguated record
Tsuyoshi Tazawa
Also filed as: TAZAWA TSUYOSHI
2 granted patents·4 pending applications·0 citations·filing 2019–2023
22Inventor score
Files withRESONAC CORP6
Top patents by PatentIndex Score
6 records- 0150US2025230344A1Adhesive film, adhesive tape, adhesive tape with release film, semiconductor device manufacturing method and semiconductor deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 0250US2025201618A1Dicing/die-bonding film and semiconductor device manufacturing methodRESONAC CORP·Filed 2023·Application pending·0 cites
- 0350US2025273503A1Method for manufacturing semiconductor device, and adhesive film for semiconductor wafer processingRESONAC CORP·Filed 2023·Application pending·0 cites
- 0447US2025157976A1Film-like adhesive and method for producing same, integrated dicing/die bonding film, and semiconductor device and method for producing sameRESONAC CORP·Filed 2023·Application pending·0 cites
- 0539US12482707B2Method of manufacturing semiconductor device and colletRESONAC CORP·Filed 2020·Granted Nov 25, 2025·0 cites·15 claims
- 0639US12451395B2Method for evaluating pickup performance, integrated dicing/die-bonding film, method for evaluating and selecting integrated dicing/die-bonding film, and method for manufacturing semiconductor deviceRESONAC CORP·Filed 2019·Granted Oct 21, 2025·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →