Inventor · disambiguated record
Tsuyoshi Tomoyama
Also filed as: TOMOYAMA TSUYOSHI
7 granted patents·5 pending applications·8 citations·filing 2007–2024
75Inventor score
Top patents by PatentIndex Score
12 records- 0168US11056494B2Integrated assemblies having bitline contacts, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Jul 6, 2021·1 cites·17 claims
- 0268US7667317B2Semiconductor package with bypass capacitorELPIDA MEMORY INC·Filed 2007·Granted Feb 23, 2010·4 cites·17 claims
- 0367US9741723B2Semiconductor device having shallow trench isolation structureMICRON TECHNOLOGY INC·Filed 2015·Granted Aug 22, 2017·2 cites·13 claims
- 0465US11037800B2Patterning methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Jun 15, 2021·1 cites·12 claims
- 0558US12114490B2Semiconductor device and method of forming the sameMICRON TECHNOLOGY INC·Filed 2021·Granted Oct 8, 2024·0 cites·4 claims
- 0657US2024274526A1Memory Circuitry And Methods Used In Forming Memory CircuitryMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0754US11798837B2Methods for forming openings in conductive layers and using the sameMICRON TECHNOLOGY INC·Filed 2021·Granted Oct 24, 2023·0 cites·16 claims
- 0851US10573654B2Integrated assemblies having bitline contactsMICRON TECHNOLOGY INC·Filed 2018·Granted Feb 25, 2020·0 cites·22 claims
- 0948US2023363148A1Semiconductor device and method of forming the sameMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 1042US2013270677A1Semiconductor device and method of manufacturing the sameELPIDA MEMORY INC·Filed 2013·Application pending·0 cites
- 1141US2007228580A1Semiconductor device having stacked structure and method of manufacturing the sameELPIDA MEMORY INC·Filed 2007·Application pending·0 cites
- 1236US2010258907A1Semiconductor device and method of manufacturing the sameELPIDA MEMORY INC·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →